IS45S32200E-6TLA1-TR
| Part Description |
IC DRAM 64MBIT PAR 86TSOP II |
|---|---|
| Quantity | 561 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 86-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 5.5 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 86-TFSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 2M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS45S32200E-6TLA1-TR – IC DRAM 64Mbit PAR 86TSOP II
The IS45S32200E-6TLA1-TR is a 64 Mbit synchronous DRAM organized as 2M × 32 with four internal banks. It is a pipeline, fully synchronous memory device designed for high-speed parallel data transfers in 3.3 V systems.
This SDRAM targets designs requiring programmable burst operation, selectable CAS latency, and standard LVTTL interfacing, delivering predictable timing and refresh behavior for system memory applications.
Key Features
- Core / Architecture Quad-bank synchronous DRAM architecture with fully synchronous inputs and outputs referenced to the rising clock edge.
- Memory Organization 64 Mbit total capacity, internally configured as 2,048K × 32 bits (2M × 32) across four banks.
- Performance Clock frequency rated at 166 MHz (product -6 speed grade) with access time from clock of 5.5 ns (CAS latency = 3, -6 grade).
- Burst and Latency Control Programmable burst lengths (1, 2, 4, 8, full page) and programmable burst sequence (sequential/interleave); CAS latency selectable (2 or 3 clocks).
- Interface and Signaling LVTTL compatible interface and parallel memory organization for synchronous, clocked read/write operations.
- Power and Refresh Single 3.3 V supply (3.0 V – 3.6 V operating range) with self-refresh capability and standard auto-refresh support (multiple refresh cycle options noted in device documentation).
- Package and Temperature Supplied in an 86-pin TSOP-II (86-TFSOP, 0.400" / 10.16 mm width) package and specified for an operating temperature range of -40°C to +85°C (TA).
Unique Advantages
- Deterministic synchronous timing: Programmable CAS latency and synchronous operation provide predictable access timing tied directly to the clock.
- Flexible burst operation: Multiple burst lengths and sequence modes simplify block transfers and can optimize bus utilization for burst read/write patterns.
- Standard 3.3 V support: Single 3.3 V power supply simplifies power rail design for systems using conventional SDRAM voltages.
- Compact TSOP-II package: 86-pin TSOP-II (10.16 mm width) offers a standard surface-mount footprint for dense board layouts.
- Industrial temperature rating: Specified operation from -40°C to +85°C supports deployment in a wide range of ambient conditions.
Why Choose IC DRAM 64MBIT PAR 86TSOP II?
The IS45S32200E-6TLA1-TR positions itself as a synchronous, parallel DRAM solution for designers needing a 64 Mbit memory with selectable latency and burst behavior. Its 2M × 32 organization, LVTTL interface, and 3.3 V supply make it suitable for systems that require predictable, clocked memory access and straightforward integration into parallel memory buses.
For designs demanding modular, industry-temperature rated SDRAM in an 86-pin TSOP-II package, this device delivers configurable timing, refresh capability, and standard interfacing to support robust system memory implementations.
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