IS45S32200E-6TLA1-TR

IC DRAM 64MBIT PAR 86TSOP II
Part Description

IC DRAM 64MBIT PAR 86TSOP II

Quantity 561 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package86-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size64 MbitAccess Time5.5 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging86-TFSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization2M x 32
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS45S32200E-6TLA1-TR – IC DRAM 64Mbit PAR 86TSOP II

The IS45S32200E-6TLA1-TR is a 64 Mbit synchronous DRAM organized as 2M × 32 with four internal banks. It is a pipeline, fully synchronous memory device designed for high-speed parallel data transfers in 3.3 V systems.

This SDRAM targets designs requiring programmable burst operation, selectable CAS latency, and standard LVTTL interfacing, delivering predictable timing and refresh behavior for system memory applications.

Key Features

  • Core / Architecture  Quad-bank synchronous DRAM architecture with fully synchronous inputs and outputs referenced to the rising clock edge.
  • Memory Organization  64 Mbit total capacity, internally configured as 2,048K × 32 bits (2M × 32) across four banks.
  • Performance  Clock frequency rated at 166 MHz (product -6 speed grade) with access time from clock of 5.5 ns (CAS latency = 3, -6 grade).
  • Burst and Latency Control  Programmable burst lengths (1, 2, 4, 8, full page) and programmable burst sequence (sequential/interleave); CAS latency selectable (2 or 3 clocks).
  • Interface and Signaling  LVTTL compatible interface and parallel memory organization for synchronous, clocked read/write operations.
  • Power and Refresh  Single 3.3 V supply (3.0 V – 3.6 V operating range) with self-refresh capability and standard auto-refresh support (multiple refresh cycle options noted in device documentation).
  • Package and Temperature  Supplied in an 86-pin TSOP-II (86-TFSOP, 0.400" / 10.16 mm width) package and specified for an operating temperature range of -40°C to +85°C (TA).

Unique Advantages

  • Deterministic synchronous timing: Programmable CAS latency and synchronous operation provide predictable access timing tied directly to the clock.
  • Flexible burst operation: Multiple burst lengths and sequence modes simplify block transfers and can optimize bus utilization for burst read/write patterns.
  • Standard 3.3 V support: Single 3.3 V power supply simplifies power rail design for systems using conventional SDRAM voltages.
  • Compact TSOP-II package: 86-pin TSOP-II (10.16 mm width) offers a standard surface-mount footprint for dense board layouts.
  • Industrial temperature rating: Specified operation from -40°C to +85°C supports deployment in a wide range of ambient conditions.

Why Choose IC DRAM 64MBIT PAR 86TSOP II?

The IS45S32200E-6TLA1-TR positions itself as a synchronous, parallel DRAM solution for designers needing a 64 Mbit memory with selectable latency and burst behavior. Its 2M × 32 organization, LVTTL interface, and 3.3 V supply make it suitable for systems that require predictable, clocked memory access and straightforward integration into parallel memory buses.

For designs demanding modular, industry-temperature rated SDRAM in an 86-pin TSOP-II package, this device delivers configurable timing, refresh capability, and standard interfacing to support robust system memory implementations.

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