M12L5121632A-7B(2T)
| Part Description |
SDRAM 3.3V |
|---|---|
| Quantity | 707 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | 54 pin TSOPII/ 54 Ball FBGA | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5 ns | Grade | Commercial | ||
| Clock Frequency | 143 MHz | Voltage | 2.5V | Memory Type | Volatile | ||
| Operating Temperature | 0°C – 70°C | Write Cycle Time Word Page | 14 ns | Packaging | 54 pin TSOPII/ 54 Ball FBGA | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | JEDEC | ECCN | EAR99 | HTS Code | 8542.32.00.28 |
Overview of M12L5121632A-7B(2T) – SDRAM 3.3V
The M12L5121632A-7B(2T) is a synchronous DRAM (SDRAM) memory device from ESMT, organized for parallel memory interfaces and designed for high-bandwidth, high-performance memory system applications. It provides a 32M × 16 memory organization with volatile DRAM technology and a 4-bank architecture to support programmable burst and latency modes for flexible system timing.
This device targets board-level memory subsystems requiring predictable synchronous operation, offering multiple burst lengths, selectable CAS latency, and standard surface-mount package options for compact designs.
Key Features
- Memory Capacity & Organization — 536.9 Mbit capacity organized as 32M × 16 (datasheet describes internal organization as 4 × 8,388,608 words by 16 bits) to support parallel data transfers.
- SDRAM Architecture — Four-bank operation with programmable burst length (1, 2, 4, 8 and full page) and burst type (sequential & interleave) for flexible throughput patterns.
- Timing & Performance — Rated clock frequency 143 MHz with an access time of 5 ns and a word/page write cycle time of 14 ns; supports CAS latency 2 and 3 for selectable read latency.
- Synchronous Interface & Control — Parallel memory interface with all inputs sampled on the positive edge of the system clock; LVTTL-compatible multiplexed address and standard SDRAM control signals (CLK, CS, CKE, RAS, CAS, WE, BA0/1, A0–A12).
- Data Masking & Refresh — DQM for data masking, support for burst read/single write operations, and auto/self-refresh with a 64 ms refresh period (8K cycle).
- Power & Qualification — Product data lists a 2.5V supply; the datasheet references JEDEC-standard 3.3V power supply. Grade: Commercial with JEDEC qualification and RoHS-compliant (Pb-free) construction.
- Packages & Mounting — Available in 54-pin TSOP II and 54-ball FBGA package options, surface-mount construction, and an operating temperature range of 0 °C to 70 °C.
Typical Applications
- High-bandwidth memory subsystems — Designed to serve as system memory in applications that require sustained parallel data throughput and programmable burst behavior.
- Embedded and board-level designs — Fits board designs needing a surface-mount SDRAM with configurable latency and burst options for timing-tuned interfaces.
- Buffering and frame storage — Suitable for buffering tasks that leverage burst transfers and banked memory for efficient read/write cycles.
Unique Advantages
- Programmable Latency and Burst Flexibility — CAS Latency options (2 & 3) and multiple burst lengths allow tuning of read/write timing to match system requirements.
- Four-Bank Operation — Banked architecture enables interleaved access patterns and improved effective throughput for multi-stream data handling.
- Standardized Control and Timing — Synchronous operation with positive-edge clock sampling and LVTTL-compatible signaling simplifies integration into existing SDRAM controller designs.
- Compact Package Options — Offered in 54-pin TSOP II and 54-ball FBGA surface-mount packages to accommodate space-constrained PCBs.
- Compliance and Qualification — JEDEC qualification and RoHS-compliant construction support standard manufacturing and regulatory requirements for commercial products.
- Refresh and Data Masking — Built-in auto/self refresh and DQM masking support reliable operation in sustained and burst-transfer scenarios.
Why Choose M12L5121632A-7B(2T)?
The M12L5121632A-7B(2T) positions itself as a configurable SDRAM solution for designers who need predictable synchronous timing, selectable latency, and flexible burst behavior in a compact surface-mount package. Its 4-bank architecture and parallel interface suit applications that require controlled, high-bandwidth memory accesses.
With JEDEC qualification, RoHS compliance, and commercial-grade operating temperature, this ESMT SDRAM is appropriate for procurement in mainstream embedded and board-level memory subsystems where standardization, package choice, and timing flexibility matter.
If you would like pricing or availability, request a quote or submit a procurement inquiry referencing part number M12L5121632A-7B(2T).
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