M14D1G8128A-1(2P)

The M14D1G8128A-1(2P) is a DDR2 SDRAM device from ESMT providing 1.074 Gbit of volatile DRAM organized as 128M × 8. Implemented with an internal pipelined double-data-rate architecture, it delivers two data accesses per clock cycle and is targeted at commercial-grade memory applications where JEDEC compatibility, flexible timing and compact BGA packaging are required.

Designed for board-level integration, this device combines on-chip timing and signal features to support high-speed system memory and buffer functions in commercial systems operating within 0 °C to 95 °C.

Key Features

• Memory Architecture DDR2 SDRAM, 1.074 Gbit total capacity, organized as 128M × 8 with 8-bank operation for efficient row/column access patterns.
• Performance Supports a clock frequency up to 667 MHz with typical access times specified as 15 ns and write cycle time (word/page) of 15 ns.
• JEDEC Compatibility & Timing Options JEDEC-standard device with selectable CAS latency options (3, 4, 5, 6, 7) and additive latency (0–6). Burst lengths of 4 and 8 and burst type options (sequential/interleave) are supported.
• Signal Integrity & Interfaces Differential clock inputs (CLK/CLK̄), bi-directional differential data strobe (DQS/DQS̄) with read/write alignment, on-die termination (ODT) and Off-Chip-Driver (OCD) impedance adjustment for improved signal quality. SSTL_18 interface supported.
• Built-in Timing and Refresh On-chip DLL and duty cycle corrector align data timing; auto and self-refresh supported with defined refresh intervals (8192 cycles/64 ms at 0 °C–85 °C; 8192 cycles/32 ms at >85 °C–95 °C).
• Power Nominal VDD = 1.8 V ±0.1 V and VDDQ = 1.8 V ±0.1 V as specified; on-die termination options include 50/75/150 Ω.
• Package & Mounting Surface-mount 60-ball BGA package (60 Ball BGA) for compact PCB integration.
• Commercial Grade & Temperature Range Commercial grade device with operating temperature range of 0 °C to 95 °C.

Typical Applications

• Commercial embedded systems — System memory and buffering where JEDEC-standard DDR2 SDRAM and a compact BGA footprint are required.
• Board-level memory expansion — Integration on memory modules or custom PCBs needing 1.074 Gbit DDR2 in a 128M × 8 organization.
• High-speed data buffering — Temporary storage and buffering functions that leverage double-data-rate transfers and on-die termination for signal integrity.

Unique Advantages

• JEDEC-standard interoperability — Ensures predictable behavior and compatibility within JEDEC-compliant DDR2 system designs.
• Flexible timing configuration — Multiple CAS and additive latency options plus burst-type/length choices enable tuning for a range of system timing requirements.
• Signal-quality features — On-die termination, OCD impedance adjustment and differential clock/DQS signaling help maintain signal integrity at higher data rates.
• Compact BGA footprint — 60-ball BGA surface-mount package reduces PCB area for space-constrained designs.
• Commercial temperature support — Rated for 0 °C to 95 °C, suitable for a wide range of commercial environments.

Why Choose M14D1G8128A-1(2P)?

The M14D1G8128A-1(2P) is positioned for commercial designs that require JEDEC-compliant DDR2 memory with flexible timing, integrated timing and signal features, and a compact 60-ball BGA package. Its combination of up to 667 MHz operation, selectable latency settings, on-die termination and DLL support makes it a practical choice for designers implementing board-level DDR2 memory solutions.

With vendor-provided datasheet specifications and commercial-grade operating limits, this device suits teams looking for a stable, verifiable DDR2 memory component for integration into memory modules, embedded platforms and high-speed buffering roles.

If you would like pricing, availability or to request a quote for the M14D1G8128A-1(2P), submit a request and our team will respond with a quote and ordering information.