M14D2561616A-1.5BG2C

The M14D2561616A-1.5BG2C is a JEDEC-standard DDR2 SDRAM organized as 16M × 16 for a total memory density of 268.4 Mbit. It implements internal pipelined double-data-rate architecture with on-chip DLL and differential DQS to deliver dual-edge data transfers at a 667 MHz clock (DDR2-1333 data rate).

Designed for surface-mount applications, this device operates from a 1.7 V–1.9 V supply and is supplied in an 84-ball FBGA (8 mm × 12.5 mm) package. It includes on-die termination, selectable ODT impedance, and refresh/self-refresh features for stable operation over its commercial temperature range.

Key Features

• Memory Architecture — Organized as 16M × 16 with 4 internal banks and a 1 KB page size, enabling standard DDR2 read/write operations.
• Data Rate & Timing — Rated for 667 MHz (DDR2-1333) operation with supported CAS latencies from 3 to 9 and additive latency options; the packaged part is specified as DDR2-1333 (9-10-10).
• DDR2 Core Technologies — Internal pipelined double-data-rate architecture, on-chip DLL, differential clock inputs and bi-directional differential data strobe (DQS/ /DQS) for dual-edge data capture.
• Interface & Burst — Parallel memory interface supporting burst lengths of 4 and 8 with sequential and interleave burst types; data I/O transitions are aligned with DQS.
• On-Die Termination & OCD — On-Die-Termination (ODT) with selectable 50/75/150 Ω options and Off-Chip-Driver (OCD) impedance adjustment to support signal integrity tuning.
• Refresh & Self-Refresh — Auto and self-refresh support with JEDEC refresh rates: 8192 cycles/64 ms at 0 °C–85 °C and 8192 cycles/32 ms at >85 °C–95 °C; supports Partial Array Self Refresh (PASR) and high temperature self refresh enable.
• Power — Standard DDR2 supply: VDD = 1.8 V ±0.1 V (device specified range 1.7 V–1.9 V) for low-voltage operation.
• Package & Mounting — 84-ball FBGA (8 mm × 12.5 mm × 1.2 mm body, 0.8 mm ball pitch) for compact surface-mount designs.
• Temperature & Grade — Commercial grade operation with an operating temperature range of 0 °C to 95 °C.
• Standards & Compliance — JEDEC-standard DDR2 SDRAM architecture and RoHS-compliant.

Typical Applications

• Memory subsystem modules — As a DDR2 memory device for module designs requiring 16M × 16 organization and DDR2-1333 timing.
• Board-level DRAM integration — For designers implementing parallel DDR2 interfaces in space-constrained, surface-mount BGA form factors.
• System-level memory expansion — To provide additional volatile storage where 1.8 V DDR2 operation and on-die termination are required for signal integrity tuning.

Unique Advantages

• High-speed DDR2-1333 capability — 667 MHz clock rate supports DDR2-1333 transfers, enabling higher throughput in compatible designs.
• Flexible timing options — Wide CAS latency and additive latency ranges allow design tuning to meet system timing and performance targets.
• Signal integrity features — Differential DQS, on-chip DLL, selectable ODT and OCD impedance adjustment help maintain reliable high-speed data transfers.
• Compact FBGA package — 84-ball FBGA provides dense mounting for board-level integration while preserving a small PCB footprint.
• Standards-based implementation — JEDEC compliance and documented refresh/self-refresh behaviors simplify system integration and validation.
• RoHS-compliant — Meets RoHS requirements for lead-free assembly processes.

Why Choose M14D2561616A-1.5BG2C?

The M14D2561616A-1.5BG2C positions itself as a JEDEC-compliant DDR2 SDRAM device offering DDR2-1333 performance, flexible timing, and on-die termination options in a compact 84-ball FBGA. Its 1.8 V operating point, built-in DLL and differential DQS make it suitable for designs that need standard DDR2 features with selectable signal-integrity tuning.

This device is appropriate for engineers and procurement teams specifying board-level DDR2 memory where documented timing options, refresh behavior, and commercial temperature operation (0 °C to 95 °C) are required. The combination of density, package, and supported DDR2 features provides straightforward integration into systems that require parallel DDR2 memory at the specified data rate.

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