M14D1G8128A-1.5BG2P
| Part Description |
DDR2 SDRAM 1Gbit, 667MHz, 1.8V, 60-FBGA |
|---|---|
| Quantity | 504 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | 60-FBGA | Memory Format | DRAM | Technology | DRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 1 Gbit | Access Time | 15 ns | Grade | Commercial | ||
| Clock Frequency | 667 MHz | Voltage | 1.7V ~ 1.9V | Memory Type | Volatile | ||
| Operating Temperature | 0°C – 95°C | Write Cycle Time Word Page | 15 ns | Packaging | 60-FBGA | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 128M x 8 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | JEDEC | ECCN | EAR99 | HTS Code | 8542.32.00.32 |
Overview of M14D1G8128A-1.5BG2P – DDR2 SDRAM 1Gbit, 667MHz, 1.8V, 60-FBGA
The M14D1G8128A-1.5BG2P is a DDR2 SDRAM device providing 1.074 Gbit organized as 128M × 8. It implements an internal pipelined double-data-rate architecture with on-chip DLL and 8-bank operation to deliver high-throughput parallel memory access at a maximum frequency of 667 MHz (DDR2-1333, CL 7-9-9).
Qualified to JEDEC standards and offered in a compact 60-ball FBGA surface-mount package, this commercial-grade module targets systems that require high-density DDR2 memory with defined timing and signal-integrity features within a 0 °C to 95 °C operating range.
Key Features
- Core Architecture Internal pipelined double-data-rate design with on-chip DLL and 8 bank operation supporting bi-directional differential DQS for reliable read/write timing.
- Memory Density & Organization 1.074 Gbit total capacity, organized as 128M × 8 for straightforward parallel memory interfacing.
- Data Rate & Timing Rated for 667 MHz operation (DDR2-1333, 7-9-9 speed grade); supports CAS latency options and additive latency settings documented in the datasheet.
- Signal & I/O Differential clock inputs (CLK/CLK̄), SSTL_18 interface, and DQS/DQS̄ strobe operation with write masking via DM for precise data transfers.
- On-Die Signal Integrity On-Die Termination (ODT) with selectable impedance (50/75/150 Ω) and off-chip-driver impedance adjustment to improve signal quality.
- Power VDD/VDDQ supply range 1.7 V to 1.9 V (nominal 1.8 V ±0.1 V) suitable for DDR2 SSTL_18 systems.
- Performance Characteristics Access time and write cycle time (word/page) documented at 15 ns for deterministic memory timing.
- Package & Mounting 60-FBGA surface-mount package optimized for board-level density and thermal performance.
- Qualification & Compliance JEDEC-standard DDR2 SDRAM implementation and RoHS-compliant manufacturing.
- Operating Environment Commercial temperature grade with an operating range of 0 °C to 95 °C and refresh schedules defined for standard and high-temperature conditions.
Typical Applications
- Commercial Embedded Systems — High-density DDR2 memory for embedded platforms that require defined timing, banked memory access and JEDEC-standard operation.
- Consumer Electronics — System memory for consumer devices that leverage 1.074 Gbit DDR2 storage in a compact 60-FBGA footprint.
- Networking & Communications Equipment — Parallel DDR2 interface for buffering and packet memory where burst lengths and CAS latency control are required.
- Industrial Control Systems — Commercial-grade DDR2 memory for controllers and modules operating within 0 °C to 95 °C.
Unique Advantages
- High-density DDR2 capacity: 1.074 Gbit organized as 128M × 8 provides substantial on-board memory without multiple devices.
- High data-rate support: 667 MHz (DDR2-1333) speed grade delivers doubled data transfers per clock through DDR2 architecture and DQS-based strobing.
- Signal-integrity features: On-Die Termination and selectable ODT impedances (50/75/150 Ω) plus off-chip-driver adjustment enhance signal quality on high-speed buses.
- Flexible timing: Multiple CAS and additive latency settings and burst length options allow tuning for system timing and throughput needs.
- Compact surface-mount package: 60-FBGA package enables high-density board designs while maintaining thermal and electrical performance.
- JEDEC-qualified and RoHS-compliant: Standardized behavior and environmental compliance simplify integration and procurement for commercial designs.
Why Choose M14D1G8128A-1.5BG2P?
The M14D1G8128A-1.5BG2P positions itself as a JEDEC-standard DDR2 SDRAM solution combining 1.074 Gbit density, DDR2-1333 class performance at 667 MHz, and a compact 60-FBGA package for space-constrained commercial designs. Its on-die termination, selectable ODT, and documented timing parameters provide engineers with predictable signal and timing behavior for parallel memory subsystems.
This device is suitable for teams and projects that require standardized DDR2 memory with configurable timing, defined operating voltage (1.7 V–1.9 V), and a commercial operating temperature range (0 °C–95 °C), backed by datasheet-level detail for design integration.
Request a quote or submit an inquiry to check availability, pricing, and to obtain the full datasheet for design validation and procurement.
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
Employees: 400+
Revenue: $377.8 Million
Certifications and Memberships: N/A