M14D1G1664A-2.5BG2P

The M14D1G1664A-2.5BG2P is a DDR II SDRAM device organized as 64M × 16 for a total density of 1.074 Gbit. Designed around an internal pipelined double-data-rate architecture, the device delivers two data transfers per clock cycle and is offered at a 400 MHz clock rate corresponding to DDR2-800 (5-5-5) timing.

This JEDEC-standard DDR2 memory supports differential clock inputs, bi-directional differential data strobes, on-chip DLL and on-die termination options, making it suitable for designs that require standard-compliant DDR2 system memory in a compact 84-ball FBGA package with surface-mount mounting.

Key Features

• Core Architecture Internal pipelined double-data-rate DDR II architecture enabling two data accesses per clock cycle; on-chip DLL aligns data and strobe timing.
• Density & Organization 1.074 Gbit organized as 64M × 16, supporting DDR2-800 data rate for systems that need this density and throughput.
• Performance / Timing 400 MHz clock frequency (DDR2-800), write cycle and access times of 15 ns, and support for CAS Latency options and additive latency; the -2.5BG2P grade is specified for DDR2-800 (5-5-5).
• Power VDD/VDDQ = 1.8 V ±0.1 V (device supply range 1.7 V to 1.9 V) to match SSTL_18 signaling environments.
• Interfaces & Signal Integrity Differential clock inputs (CLK/CLK), bi-directional differential DQS/DQS with single-ended option, data mask (DM) for write masking, on-die termination (ODT) and off-chip-driver impedance adjustment for improved signal quality.
• Memory Control & Refresh 8-bank operation, burst lengths of 4 and 8, sequential and interleave burst types, auto and self refresh, and specified refresh rates across temperature ranges.
• Package & Mounting 84-ball FBGA (8 mm × 12.5 mm × 1.2 mm body, 0.8 mm ball pitch) for surface-mount assembly and compact board integration.
• Operating Range & Qualification Commercial grade with JEDEC qualification and an operating temperature range of 0 °C to 95 °C.

Typical Applications

• System Memory for DDR2 Platforms Provides 1.074 Gbit organized as 64M × 16 for designs requiring DDR2-800 (5-5-5) operation at a 400 MHz clock.
• Compact, High-Density Boards The 84-ball FBGA (8×12.5, 0.8 mm pitch) package enables surface-mount integration where board area and vertical profile are constrained.
• Temperature-Constrained Commercial Designs Rated for 0 °C to 95 °C operation and JEDEC conformance for use in commercial-temperature-range products.

Unique Advantages

• JEDEC-Standard Compliance: Ensures compatibility with standard DDR2 timing and control conventions for predictable system integration.
• Flexible Timing Options: Supports multiple CAS latency and additive latency settings and burst control, enabling designers to match memory timing to system requirements; the -2.5BG2P grade is specified for DDR2-800 (5-5-5).
• Signal Integrity Features: Differential clocks, DQS/DQS strobe, ODT and OCD impedance adjustment improve timing margin and reduce board-level signal tuning effort.
• Compact Surface-Mount Package: 84-ball FBGA footprint (8×12.5 mm) reduces PCB area while supporting high-density memory on compact system boards.
• Power-Flow Consistency: 1.8 V nominal supply (VDD/VDDQ) with defined operating range supports standard SSTL_18 interfaces and predictable power design.
• Refresh and Reliability Controls: Auto/self-refresh capability and specified refresh intervals for standard temperature ranges maintain data integrity during operation and low-power states.

Why Choose M14D1G1664A-2.5BG2P?

The M14D1G1664A-2.5BG2P positions itself as a JEDEC-compliant DDR2 memory device delivering 1.074 Gbit density in a 64M × 16 organization with DDR2-800 (5-5-5) timing at a 400 MHz clock. Its combination of on-chip DLL, differential strobe and clocking, on-die termination options and compact 84-ball FBGA package make it a practical choice for engineers integrating DDR2 system memory where board space, standard signaling, and predictable timing are priorities.

This device is suited to commercial-temperature designs that require standard DDR2 performance, compact surface-mount packaging and signal-integrity features that simplify board-level design and tuning.

Request a quote or submit an inquiry to obtain pricing, availability and lead-time information for the M14D1G1664A-2.5BG2P DDR2 SDRAM. Our team can assist with ordering details and supply options.