M14D2561616A-2(2C)

The M14D2561616A-2(2C) is an industrial-grade DDR2 SDRAM organized as 16M × 16 for a total density of 268.4 Mbit. It implements a pipelined double-data-rate architecture with a parallel memory interface and is JEDEC-qualified for embedded and industrial applications.

Targeted for systems that require extended temperature operation and reliable DRAM performance, this device provides DDR2-800 operation (400 MHz) with on-chip timing, signal integrity features and surface-mount BGA packaging for compact, high-density designs.

Key Features

• Core Architecture Pipelined DDR2 SDRAM with double-data-rate operation (two data accesses per clock cycle) and an on-chip DLL for timing alignment.
• Memory Organization 268.4 Mbit total capacity in a 16M × 16 organization with 4 internal banks and a 1 KB page size for typical DRAM access patterns.
• Performance Clock frequency rated at 400 MHz (DDR2-800), typical access time 15 ns and write cycle time (word/page) 15 ns; supports multiple CAS latencies and additive latency settings.
• Power and Interface Series datasheet specifies VDD = 1.8V ±0.1V and VDDQ = 1.8V ±0.1V; SSTL_18 interface with differential clock inputs and bidirectional differential data strobe (DQS/ DQS̄).
• Signal Integrity & Timing On-die termination (ODT) with selectable levels (50/75/150 Ω), duty-cycle corrector (DCC), differential clocks, and data strobe features (edge-aligned READ, center-aligned WRITE) to improve timing margin.
• Reliability & Power Management JEDEC-qualified industrial grade with auto and self-refresh, partial array self-refresh (PASR), high-temperature self-refresh rate enable, and selectable refresh intervals for -40°C to +95°C operation.
• Package & Mounting 84-ball BGA surface-mount package (8 mm × 12.5 mm × 1.2 mm body, 0.8 mm ball pitch) suitable for compact board layouts.
• Standards Compliance JEDEC-standard DDR2 features including burst lengths, burst types, CAS latency options and standard refresh cycles (8192 cycles/64 ms at ≤ +85°C; 8192 cycles/32 ms at > +85°C to +95°C).
• Environmental Industrial operating temperature range of -40°C to +95°C and RoHS compliant.

Typical Applications

• Industrial Embedded Systems — Extended temperature rating and JEDEC qualification make this memory suitable for controllers and embedded boards in factory automation and instrumentation.
• Networking and Communications Equipment — DDR2-800 performance and on-die termination features support buffering and packet-processing memory needs in networking modules.
• Telecom and Infrastructure — Reliable refresh behavior and selectable ODT values suit memory subsystems in telecom line cards and infrastructure appliances.

Unique Advantages

• Industrial Temperature Range: Operation from -40°C to +95°C enables deployment in harsh and temperature-variable environments.
• DDR2-800 Performance: 400 MHz clocking with 15 ns access and write-cycle times addresses mid-range bandwidth needs while maintaining predictable timing.
• Flexible Timing Options: Wide CAS latency and additive latency support allow designers to tune timing for system-level trade-offs.
• Signal Integrity Controls: On-die termination (50/75/150 Ω), DCC and differential DQS/clock inputs improve timing margins and reduce board-level tuning.
• Compact BGA Packaging: 84-ball BGA surface-mount package provides high-density mounting for space-constrained boards.
• JEDEC Qualification: Compliance with DDR2 JEDEC standards simplifies system validation and integration.

Why Choose M14D2561616A-2(2C)?

The M14D2561616A-2(2C) balances DDR2-800 performance, industrial temperature capability and JEDEC-standard feature set to meet the requirements of embedded and communications designs that need dependable DRAM in compact packages. Its combination of on-chip DLL, ODT options, refresh modes and flexible latency settings enables designers to optimize system timing and signal integrity without extensive board-level tuning.

This device is suited for engineers specifying memory for industrial controllers, networking modules and telecom infrastructure where thermal endurance, standard compliance and predictable DDR2 behavior are required. The BGA 84 surface-mount package supports high-density board layouts and straightforward BOM integration.

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