M14D2561616A-2.5BG2C

The M14D2561616A-2.5BG2C is a commercial-grade DDR2 SDRAM device from ESMT, organized as 16M × 16 with quad-bank architecture and a pipelined double-data-rate core. It delivers DDR2-800 operation at a 400 MHz clock (double data rate) in a compact 84-ball FBGA surface-mount package.

Engineered for systems requiring JEDEC-compliant DDR2 memory, this device provides flexible timing options, on-die termination and DDR2 interface features to support board-level integration into commercial embedded designs.

Key Features

• Core / Architecture Internal pipelined double-data-rate architecture with bi-directional differential data strobe (DQS) and on-chip DLL for timing alignment.
• Memory Organization & Capacity 16M × 16 organization with quad bank operation and a 1 KB page size. Memory size is listed as 268.4 Mbit in product specifications.
• Performance & Timing 400 MHz clock (DDR2-800 data rate for this ordering option), access time and write cycle time of 15 ns; supports CAS latencies 3–9 and burst lengths of 4 and 8.
• Interface & Signal Features Parallel SSTL_18 interface with differential clock inputs (CLK / CLK̄), DQS edge/center alignment behavior, data mask (DM) for write masking, and support for single-ended or differential DQS operation.
• Power VDD / VDDQ operation at 1.8 V ± 0.1 V (listed voltage supply range 1.7 V–1.9 V).
• Signal Integrity & On-Chip Controls On-Die Termination (ODT) with selectable 50/75/150 Ω, Off-Chip-Driver (OCD) impedance adjustment and Duty Cycle Corrector (DCC) support.
• Reliability & JEDEC Compliance JEDEC-standard DDR2 feature set with auto/self-refresh, partial array self refresh (PASR) and high-temperature self-refresh rate enable; commercial-grade qualification.
• Package & Mounting 84-FBGA (8.0 mm × 12.5 mm × 1.2 mm body, 0.8 mm ball pitch), surface-mount package suitable for compact board layouts.
• Operating Range & Environmental Commercial operating temperature 0 °C to 95 °C and RoHS-compliant material declaration.

Typical Applications

• System Memory for Commercial Embedded Designs — Compact DDR2-800 memory for embedded boards and modules that require JEDEC-compliant DDR2 SDRAM in an FBGA package.
• Board-Level Integration — Surface-mount 84-FBGA footprint for integration into small-form-factor designs where footprint and standard DDR2 signaling are required.
• Buffering and Working Memory — DDR2 SDRAM suited for applications needing parallel SSTL_18 interface memory with selectable CAS latencies and burst modes.

Unique Advantages

• Flexible Timing Options: Multiple CAS latency settings (3–9) and additive latency choices provide design flexibility across performance and timing constraints.
• Signal Integrity Controls: On-Die Termination and OCD impedance adjustment improve signal quality for high-speed DDR2 operation.
• Compact, Industry-Standard Package: 84-FBGA surface-mount package enables dense board layouts while maintaining DDR2 interface routing conventions.
• JEDEC Compliance: Standard DDR2 feature set with auto/self-refresh and PASR aligns with established system design and validation practices.
• Commercial Temperature Rating: Rated 0 °C to 95 °C for a broad range of commercial deployments.
• RoHS Compliant: Material compliance supports environmental and manufacturing requirements.

Why Choose M14D2561616A-2.5BG2C?

The M14D2561616A-2.5BG2C combines DDR2-800 class performance at a 400 MHz clock with JEDEC-standard DDR2 features, on-die termination and flexible timing options—making it a practical choice for commercial embedded systems and compact board-level memory implementations. Its 84-FBGA package and surface-mount mounting support compact layouts while adhering to established DDR2 signaling and power requirements.

This device is well suited to designers who require a JEDEC-compliant DDR2 SDRAM solution with configurable latency, robust signal integrity features and a commercial temperature rating, backed by ESMT’s documented device specifications and feature set.

Request a quote or submit an RFQ to receive pricing, availability and ordering information for the M14D2561616A-2.5BG2C.