MT29F256G08APEDBJ6-12:D
| Part Description |
IC FLASH 256GBIT PAR 132LBGA |
|---|---|
| Quantity | 39 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 132-LBGA (12x18) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Commercial | ||
| Clock Frequency | 83 MHz | Voltage | 2.5V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 132-LBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MT29F256G08APEDBJ6-12:D – IC FLASH 256GBIT PAR 132LBGA
The MT29F256G08APEDBJ6-12:D is a 256 Gbit non-volatile parallel flash memory device implemented in SLC NAND technology. It is organized as 32G × 8 and provided in a 132-LBGA (12x18) package.
This device targets systems that require high-density parallel flash storage with a 2.5 V to 3.6 V supply window, an 83 MHz clock specification, and a commercial operating temperature range of 0°C to 70°C.
Key Features
- Memory (Capacity & Organization) 256 Gbit total capacity, organized as 32G × 8 to support byte-wide parallel data paths.
- Technology FLASH - NAND (SLC) non-volatile memory technology.
- Interface Parallel memory interface for direct parallel bus integration.
- Clock 83 MHz clock frequency specification.
- Voltage Supply Operates from 2.5 V to 3.6 V to accommodate common system supply rails.
- Package 132-LBGA package (12x18) for a compact board footprint and BGA solder mounting.
- Operating Temperature Commercial ambient range: 0°C to 70°C (TA).
Unique Advantages
- High-density storage: 256 Gbit capacity consolidates large amounts of flash storage into a single device.
- SLC NAND implementation: Built with SLC NAND flash technology as specified in the product data.
- Parallel interface compatibility: Byte-wide 32G × 8 organization supports direct parallel bus connectivity.
- Flexible supply range: 2.5 V to 3.6 V operation enables use across common voltage domains.
- Compact BGA package: 132-LBGA (12x18) package provides a space-efficient surface-mount option.
- Defined clock and thermal specs: 83 MHz clock frequency and 0°C to 70°C operating range give clear electrical and environmental parameters for design integration.
Why Choose MT29F256G08APEDBJ6-12:D?
This device is positioned for designs that require a high-capacity, parallel SLC NAND flash solution with clearly specified electrical, timing, and packaging characteristics. Its 256 Gbit organization, 83 MHz clock rating, and 2.5 V–3.6 V supply range provide a defined set of parameters for system integration.
Choose this part when you need a compact 132-LBGA packaged flash device with a byte-wide memory organization and commercial temperature operation for applications requiring non-volatile parallel storage.
Request a quote or contact sales to submit a quote for MT29F256G08APEDBJ6-12:D and to discuss availability and lead times.
