MT29F256G08AUAAAC5-ITZ:A

The MT29F256G08AUAAAC5-ITZ:A is a 256 Gbit non-volatile flash memory device based on NAND SLC technology with a parallel memory interface. It provides high-density storage in a compact 52‑VLGA (18×14) package and supports a broad supply range and extended operating temperature.

This device is intended for designs that require parallel NAND flash storage with a 32G × 8 organization, a 2.7 V to 3.6 V supply range, and an industrial temperature capability of −40°C to 85°C.

Key Features

• Memory Core NAND SLC flash technology providing single-level cell storage in a 256 Gbit device.
• Capacity & Organization 256 Gbit capacity organized as 32G × 8 for high-density storage integration.
• Interface Parallel memory interface for direct system integration where parallel flash is required.
• Voltage Supply Operates over a 2.7 V to 3.6 V supply range to accommodate common system power rails.
• Package 52‑VLGA package (18×14) offering a compact form factor for board-level integration.
• Temperature Range Qualified for operation from −40°C to 85°C (TA) for use in environments requiring extended temperature capability.

Typical Applications

• Embedded Storage — Provides 256 Gbit non-volatile storage via a parallel interface for embedded systems that require high-density flash.
• Industrial Equipment — Suited for industrial designs needing extended temperature operation (−40°C to 85°C) and a 2.7 V–3.6 V supply range.
• Firmware and Code Storage — Compact 52‑VLGA package and parallel interface enable board-level integration for firmware storage and system boot code.
• Consumer & Communications Modules — High-capacity parallel flash for modules and devices that integrate on-board non-volatile memory within a small footprint.

Unique Advantages

• High Density in Compact Package: 256 Gbit capacity delivered in a 52‑VLGA (18×14) package to save board space while maximizing storage.
• Parallel Interface for Direct Integration: Parallel memory interface simplifies connection to controllers that support parallel NAND flash.
• SLC NAND Technology: Single-level cell architecture used for the flash core as specified.
• Wide Supply Compatibility: 2.7 V to 3.6 V operating range aligns with common system power rails.
• Extended Operating Temperature: Rated for −40°C to 85°C to support applications with wider thermal requirements.

Why Choose MT29F256G08AUAAAC5-ITZ:A?

The MT29F256G08AUAAAC5-ITZ:A positions itself as a high-density parallel NAND SLC flash device that balances capacity and compact packaging for embedded designs. Its 32G × 8 organization, 2.7 V–3.6 V supply range, and −40°C to 85°C operating capability make it suitable for systems requiring robust, board-level non-volatile storage in a 52‑VLGA footprint.

This device is appropriate for engineers and procurement teams specifying parallel NAND flash where capacity, package size, and extended temperature operation are primary considerations.

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