MT29F256G08AUCABH3-10IT:A

The MT29F256G08AUCABH3-10IT:A is a 256 Gbit non-volatile NAND flash memory organized as 32G × 8, implemented in SLC NAND flash technology. It provides parallel memory interface operation up to a 100 MHz clock frequency and is supplied in a 100-LBGA (12×18) package.

This device targets systems that require high-density parallel flash storage with a 2.7 V to 3.6 V supply range and an operating temperature range of −40 °C to 85 °C, where a compact BGA package and defined electrical interfaces are required.

Key Features

• Memory Architecture 256 Gbit capacity organized as 32G × 8, implemented using FLASH - NAND (SLC) technology for non-volatile storage.
• Interface & Performance Parallel memory interface with a specified clock frequency of 100 MHz for synchronous operation with parallel host controllers.
• Voltage Supply Operates from 2.7 V to 3.6 V, supporting common 3 V system rails.
• Package Supplied in a 100-LBGA package (12×18 mm), enabling compact board integration with BGA assembly processes.
• Environmental Range Rated for an ambient operating temperature range of −40 °C to 85 °C (TA), suitable for extended temperature designs.
• Memory Format & Organization FLASH memory format with a byte-wide (×8) organization simplifying parallel data access and memory mapping.

Typical Applications

• High-Capacity Non-Volatile Storage Use where 256 Gbit of FLASH NAND is required for program or data retention in systems with parallel memory interfaces.
• Embedded Systems Suitable for embedded designs that require a compact 100-LBGA package and a 2.7 V–3.6 V supply range.
• Industrial Equipment Applicable to equipment operating within −40 °C to 85 °C that needs dense non-volatile storage in a BGA footprint.

Unique Advantages

• High Density Storage: 256 Gbit capacity (32G × 8) enables large data or code storage in a single device, reducing board-level part count.
• Parallel Interface Simplicity: Byte-wide parallel interface at up to 100 MHz allows straightforward connection to parallel memory controllers and simple data bus integration.
• Wide Supply Voltage: 2.7 V to 3.6 V operation supports common 3 V systems and provides flexibility across different power domains.
• Compact BGA Packaging: 100-LBGA (12×18) package delivers a dense footprint for space-constrained PCBs while maintaining a standardized assembly form factor.
• Extended Operating Temperature: −40 °C to 85 °C rating supports deployment in environments with varying thermal conditions.

Why Choose IC FLASH 256GBIT PAR 100LBGA?

The MT29F256G08AUCABH3-10IT:A positions itself as a high-density, parallel-access SLC NAND flash device focused on compact integration and defined electrical characteristics. Its 256 Gbit capacity, parallel interface at 100 MHz, and 100-LBGA package make it suitable for designs that require large non-volatile storage in a small form factor.

Designers and procurement teams seeking a stable flash memory option with a 2.7 V–3.6 V supply range and an operating temperature span of −40 °C to 85 °C will find this device aligned with applications needing robust storage density and straightforward parallel bus connectivity.

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