MT29F256G08AUAAAC5:A

The MT29F256G08AUAAAC5:A is a 256 Gbit non-volatile NAND flash memory device in an SLC architecture with a parallel 8-bit interface. It provides high-density parallel flash storage organized as 32G × 8 and is offered in a 52‑VLGA (18 × 14) package.

This device is intended for systems that require parallel NAND storage with a wide voltage range (2.7 V to 3.6 V) and standard commercial operating temperature (0 °C to 70 °C). Its form factor and interface make it suitable for embedded designs where parallel flash integration and significant capacity are required.

Key Features

• Memory Type  Non-volatile NAND flash using SLC technology for single-level cell storage.
• Capacity & Organization  256 Gbit total capacity arranged as 32G × 8, enabling large on-board storage in a parallel 8-bit format.
• Interface  Parallel 8-bit memory interface suitable for designs that use parallel flash connections.
• Supply Voltage  Operates from 2.7 V to 3.6 V, accommodating common 3.0 V system rails.
• Package  52‑VLGA (18 × 14) package for compact board-level integration.
• Operating Temperature  Rated for 0 °C to 70 °C (TA), aligning with commercial temperature-range applications.

Typical Applications

• Embedded Systems  Parallel 8-bit NAND storage for firmware, large data buffers, or application code in embedded devices.
• Consumer Electronics  High-density non-volatile memory for devices requiring substantial local storage in a compact VLGA package.
• Storage Modules  Integration into parallel flash modules or boards where 256 Gbit capacity and SLC NAND are required.

Unique Advantages

• High-density storage: 256 Gbit capacity organized as 32G × 8 provides substantial on-board memory for data- and firmware-heavy designs.
• SLC NAND architecture: Single-level cell NAND flash supports use cases that require straightforward cell-level storage characteristics.
• Parallel interface compatibility: The 8-bit parallel interface simplifies reuse in designs that rely on parallel flash connectivity.
• Flexible power range: 2.7 V to 3.6 V supply range supports common 3.0 V system rails and simplifies power integration.
• Compact packaging: 52‑VLGA (18 × 14) package enables high-density board placement while maintaining a standardized footprint.
• Commercial temperature rating: 0 °C to 70 °C operation fits typical commercial applications and environments.

Why Choose MT29F256G08AUAAAC5:A?

The MT29F256G08AUAAAC5:A positions itself as a high-capacity, parallel-interface NAND flash solution for designs that require 8-bit parallel connectivity, a wide supply voltage window, and a compact VLGA footprint. Its 256 Gbit SLC NAND organization addresses applications needing significant non-volatile storage in a standard commercial temperature range.

This device is suited to designers and procurement teams targeting embedded and consumer systems that integrate parallel flash memory with minimal footprint impact. The combination of capacity, packaging, and voltage flexibility supports scalable board-level implementations where verified component characteristics are essential.

For pricing, availability, or to request a formal quote for MT29F256G08AUAAAC5:A, submit a request to sales or request a quote through your preferred procurement channel.