MT29F256G08AMCBBH7-6IT:B

The MT29F256G08AMCBBH7-6IT:B is a 256 Gbit non-volatile flash memory device from Micron Technology Inc. It implements NAND flash memory in an SLC architecture with a parallel memory interface and a 32G × 8 organization.

Designed for systems that require parallel-interface flash storage, the device provides a defined operating range, supply voltage window, and a compact 152-TBGA package for space-constrained board designs.

Key Features

• Memory Type and Architecture Non-volatile FLASH - NAND (SLC) memory providing a 256 Gbit capacity in a 32G × 8 organization.
• Interface and Performance Parallel memory interface with a specified clock frequency of 167 MHz for synchronous operation with parallel host interfaces.
• Power Supply Single supply operation across a 2.7 V to 3.6 V range to accommodate common system power rails.
• Package 152-TBGA package (14 × 18 mm) for compact board-level integration; supplier device package listed as 152-TBGA (14×18).
• Operating Temperature Specified ambient operating range of −40 °C to 85 °C (TA) for deployment across a wide thermal envelope.
• Memory Format and Organization FLASH memory format with 32G × 8 organization suitable for parallel access patterns and fixed-bit-width systems.

Typical Applications

• Parallel-interface non-volatile storage — Used where a parallel NAND SLC device is required for bulk non-volatile memory.
• Embedded system code and data storage — Provides on-board storage in systems that accept a parallel memory interface and require SLC flash.
• Space-constrained hardware — 152-TBGA package suited to designs with limited board area that still require a high-capacity flash device.

Unique Advantages

• High density—256 Gbit: Enables large non-volatile storage capacity in a single device, reducing the need for multiple components.
• SLC NAND architecture: Single-level cell flash organization as specified, providing a defined flash type for system-level integration.
• Parallel interface with 167 MHz clock: Supports synchronous parallel connectivity at the listed clock rate for compatible host designs.
• Wide operating temperature: −40 °C to 85 °C rating supports deployment across varied ambient environments.
• Flexible supply voltage: 2.7 V to 3.6 V operation aligns with common system power rails for straightforward integration.
• Compact TBGA packaging: 152-TBGA (14×18) package reduces board footprint while maintaining device integration.

Why Choose IC FLASH 256GBIT PAR 152TBGA?

The MT29F256G08AMCBBH7-6IT:B is positioned for designs that require a 256 Gbit parallel SLC NAND flash in a compact TBGA footprint, offering a defined clock rate and voltage window for system-level integration. Its specified operating temperature range and package dimensions make it suitable for projects that need verified physical and electrical parameters from the memory device.

This device is appropriate for engineers and procurement teams specifying parallel-interface non-volatile memory where the listed capacity, interface type, package, supply range, and temperature rating are required design inputs.

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