MT29F256G08AKCBBH7-6IT:B TR
| Part Description |
IC FLASH 256GBIT PAR 152TBGA |
|---|---|
| Quantity | 884 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 152-TBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 167 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 152-TBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MT29F256G08AKCBBH7-6IT:B TR – IC FLASH 256GBIT PAR 152TBGA
The MT29F256G08AKCBBH7-6IT:B TR is a 256 Gbit non-volatile flash memory device implemented as SLC NAND in a parallel interface configuration. It provides a 32G × 8 memory organization and supports a 167 MHz clock, delivering a high-density parallel flash option in a compact 152-TBGA (14×18) package.
This device is intended for designs requiring onboard non-volatile storage with a parallel interface, operating from a 2.7 V to 3.6 V supply and specified for an ambient temperature range of −40 °C to 85 °C.
Key Features
- Memory Technology Single-Level Cell (SLC) NAND flash providing 256 Gbit non-volatile storage in FLASH format.
- Memory Organization Organized as 32G × 8 to match parallel system architectures and memory mapping requirements.
- Interface & Timing Parallel memory interface with support for a 167 MHz clock frequency for synchronous operation with parallel controllers.
- Voltage Supply Operates from a 2.7 V to 3.6 V supply range, enabling compatibility with common 3 V system rails.
- Package Supplied in a 152-TBGA (14×18) package case suitable for compact board-level integration.
- Operating Temperature Rated for ambient operation from −40 °C to 85 °C (TA), covering a wide commercial/industrial temperature range.
Typical Applications
- Embedded storage modules — Provides high-density non-volatile storage for embedded systems that require parallel flash memory.
- Firmware and code storage — Stores firmware, boot code, or large data sets where SLC NAND FLASH is specified.
- Board-level memory expansion — Used as a parallel FLASH option for designs needing 256 Gbit capacity in a compact TBGA package.
Unique Advantages
- High density 256 Gbit capacity: Delivers substantial non-volatile storage in a single device to reduce board-level component count.
- Parallel interface with 167 MHz clock: Enables integration with parallel memory controllers and timing domains that use a 167 MHz clock rate.
- SLC NAND technology: Implements single-level cell FLASH NAND architecture as specified in the product data.
- Wide supply voltage: 2.7 V to 3.6 V operation allows compatibility with common 3 V system rails.
- Compact 152-TBGA package (14×18): Supports high-density board layouts while keeping a small footprint.
- Wide operating temperature range: Specified for −40 °C to 85 °C ambient operation for temperature-sensitive applications.
Why Choose IC FLASH 256GBIT PAR 152TBGA?
The MT29F256G08AKCBBH7-6IT:B TR positions itself as a high-density, parallel-interface SLC NAND FLASH device suitable for designs that require 256 Gbit of non-volatile storage in a compact 152-TBGA package. Its 32G × 8 organization, 167 MHz clock support, and 2.7 V–3.6 V supply range make it appropriate for systems that map to parallel memory architectures and need a wide ambient temperature range.
This device is suited to engineers and procurement teams specifying board-level parallel flash for embedded storage, firmware retention, or memory expansion where the listed electrical, package, and temperature characteristics match design requirements.
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