MT29E512G08CMCBBH7-6:B TR

IC FLASH 512GBIT PARALLEL 167MHZ
Part Description

IC FLASH 512GBIT PARALLEL 167MHZ

Quantity 1,033 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageN/AMemory FormatFLASHTechnologyFLASH - NAND
Memory Size512 GbitAccess TimeN/AGradeCommercial
Clock Frequency167 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackagingN/A
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization64G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCNOBSOLETEHTS CodeN/A

Overview of MT29E512G08CMCBBH7-6:B TR – IC FLASH 512GBIT PARALLEL 167MHZ

The MT29E512G08CMCBBH7-6:B TR from Micron Technology Inc. is a 512 Gbit non-volatile NAND flash memory device organized as 64G × 8 with a parallel memory interface. It provides a 167 MHz clock frequency and operates from a 2.7 V to 3.6 V supply.

This device is intended for designs that require high-density non-volatile storage within the specified commercial temperature range of 0°C to 70°C, offering straightforward integration where a parallel flash interface and defined electrical ranges are required.

Key Features

  • Memory Type and Technology Non-volatile NAND flash memory suitable for persistent data storage.
  • Density and Organization 512 Gbit capacity organized as 64G × 8 to deliver high-density storage in a single device.
  • Interface and Timing Parallel memory interface with a 167 MHz clock frequency for synchronous operation with host controllers that support parallel flash.
  • Voltage Supply Wide supply voltage range from 2.7 V to 3.6 V to support typical 3 V system rails.
  • Operating Temperature Commercial operating range of 0°C to 70°C for standard-environment applications.

Typical Applications

  • Storage Subsystems — Provides high-density non-volatile storage for systems that require large-capacity flash in a parallel memory format.
  • Embedded Systems — Used where on-board persistent storage is required and integration with parallel memory controllers is preferred.
  • Consumer Electronics — Suitable for consumer devices that need large NAND flash capacity within the commercial temperature and voltage ranges provided.

Unique Advantages

  • High Capacity — 512 Gbit density supports applications that need substantial non-volatile storage in a single device.
  • Parallel Interface — Parallel memory interface with a defined 167 MHz clock provides deterministic timing for compatible host designs.
  • Flexible Power Range — Operates across 2.7 V to 3.6 V, allowing compatibility with common 3 V system power rails.
  • Commercial Temperature Support — Specified for 0°C to 70°C operation to match standard commercial-environment deployments.
  • Established Manufacturer — Supplied by Micron Technology Inc., a known provider of memory components.

Why Choose IC FLASH 512GBIT PARALLEL 167MHZ?

The MT29E512G08CMCBBH7-6:B TR is positioned for designs that prioritize high-density NAND flash storage with a parallel interface and defined electrical and thermal ranges. Its 512 Gbit capacity, 64G × 8 organization, and 167 MHz clock make it suitable for systems requiring substantial non-volatile memory in a parallel format.

Choose this device when your design requires a Micron-sourced NAND flash offering clear supply voltage and operating temperature specifications to support predictable integration and long-term deployment in commercial environments.

Request a quote or submit an inquiry for pricing and availability to evaluate the MT29E512G08CMCBBH7-6:B TR for your design requirements.

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