MT29F256G08CMAAAC5:A
| Part Description |
IC FLASH 256GBIT PAR 52VLGA |
|---|---|
| Quantity | 1,902 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 52-VLGA (18x14) | Memory Format | FLASH | Technology | FLASH - NAND (MLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Commercial | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 52-VLGA | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MT29F256G08CMAAAC5:A – IC FLASH 256GBIT PAR 52VLGA
The MT29F256G08CMAAAC5:A is a 256 Gbit non-volatile NAND flash memory in a parallel interface configuration. It uses MLC NAND technology with a memory organization of 32G × 8 and is specified for operation with a 2.7 V to 3.6 V supply.
Designed for designs that require high-density parallel flash storage, the device is offered in a 52-VLGA (18 × 14) package and is specified for operation up to 200 MHz clock frequency with an ambient operating temperature range of 0°C to 70°C.
Key Features
- Memory Type Non-volatile NAND flash using MLC technology, providing 256 Gbit of storage capacity.
- Memory Organization Organized as 32G × 8, enabling byte-wide parallel access patterns.
- Interface and Performance Parallel memory interface with a specified clock frequency of 200 MHz.
- Power Operates from a 2.7 V to 3.6 V supply range.
- Package Supplied in a 52-VLGA package (18 × 14) suited for board-level mounting.
- Operating Temperature Ambient temperature range specified as 0°C to 70°C (TA).
Typical Applications
- Embedded memory modules — Use where a 256 Gbit parallel NAND flash (32G × 8) is required for non-volatile storage.
- Firmware and code storage — Suitable for systems that need parallel FLASH storage supplied at 2.7 V–3.6 V and rated to 200 MHz clocking.
- Parallel flash designs — Intended for designs that integrate a 52-VLGA (18 × 14) packaged parallel NAND device within 0°C–70°C ambient environments.
Unique Advantages
- High density storage: 256 Gbit capacity supports large on-board data or code storage requirements without external expansion.
- Byte-wide organization: 32G × 8 organization enables parallel byte access suitable for legacy parallel flash architectures.
- Standard supply voltage: 2.7 V–3.6 V power range aligns with common system power rails.
- Compact package: 52-VLGA (18 × 14) package provides a space-efficient footprint for board-level integration.
- Specified operating window: 0°C–70°C ambient rating and a 200 MHz clock rating provide clear design constraints for selection and verification.
Why Choose IC FLASH 256GBIT PAR 52VLGA?
The MT29F256G08CMAAAC5:A positions itself as a high-density parallel NAND flash option that combines MLC technology, a 32G × 8 organization, and a 52-VLGA package for compact board-level integration. Its electrical and thermal specifications—2.7 V–3.6 V supply and 0°C–70°C operating range—provide clear parameters for system design and validation.
This device is suitable for designers and procurement teams specifying parallel NAND flash for embedded storage or firmware retention where 256 Gbit capacity and a 200 MHz clock rating are required. The defined specifications make it straightforward to assess fit within existing parallel-memory architectures and power/thermal envelopes.
Request a quote or submit an inquiry to get pricing and availability information for the MT29F256G08CMAAAC5:A IC FLASH 256GBIT PAR 52VLGA.
