MT29F256G08CMCABH2-10RZ:A TR

IC FLASH 256GBIT PAR 100TBGA
Part Description

IC FLASH 256GBIT PAR 100TBGA

Quantity 1,362 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-TBGA (12x18)Memory FormatFLASHTechnologyFLASH - NAND (MLC)
Memory Size256 GbitAccess TimeN/AGradeCommercial
Clock Frequency100 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging100-TBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization32G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F256G08CMCABH2-10RZ:A TR – IC FLASH 256GBIT PAR 100TBGA

The MT29F256G08CMCABH2-10RZ:A TR is a 256 Gbit non-volatile NAND flash memory device using MLC (multi-level cell) technology and a parallel memory interface. It is organized as 32G × 8 and provided in a 100-TBGA (12×18) package.

Key electrical and environmental characteristics include a 100 MHz clock frequency, a supply voltage range of 2.7 V to 3.6 V, and an operating ambient temperature range of 0°C to 70°C.

Key Features

  • Memory Core  Non-volatile NAND flash (MLC) technology delivering 256 Gbit of storage capacity.
  • Memory Organization  Configured as 32G × 8 for byte-wide access and straightforward memory mapping.
  • Interface & Performance  Parallel memory interface with a 100 MHz clock frequency to match parallel host architectures.
  • Voltage  Operates from a 2.7 V to 3.6 V supply range to accommodate systems within that voltage window.
  • Package  100-TBGA (12×18) package for high-density board mounting.
  • Operating Temperature  Specified ambient temperature range of 0°C to 70°C (TA).
  • Memory Format & Size  FLASH memory format with a total capacity of 256 Gbit.

Unique Advantages

  • High-density storage: 256 Gbit capacity in a single device reduces the need for multiple memory packages on the board.
  • Parallel interface compatibility: Parallel memory interface and 100 MHz clock frequency simplify integration with parallel host controllers.
  • Wide supply range: 2.7 V–3.6 V voltage range provides flexibility across systems requiring that operating window.
  • Compact, mountable package: 100-TBGA (12×18) offers a small-footprint solution for space-constrained board designs.
  • Commercial temperature rating: 0°C–70°C operating range targets standard commercial applications.

Why Choose IC FLASH 256GBIT PAR 100TBGA?

The IC FLASH 256GBIT PAR 100TBGA provides a high-density MLC NAND flash option in a compact 100-TBGA package, delivering 256 Gbit of parallel-access non-volatile storage. Its 32G × 8 organization, 100 MHz clock, and 2.7 V–3.6 V operating window make it suitable for designs that require substantial on-board flash capacity with parallel interface connectivity.

This device is appropriate for customers seeking a straightforward, high-capacity flash component in a compact package and standard commercial temperature range, enabling simplified board layouts and predictable electrical requirements.

Request a quote or contact sales to obtain pricing, lead-time information, and availability for the MT29F256G08CMCABH2-10RZ:A TR.

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