MT29F256G08EFEBBWP-M:B TR
| Part Description |
IC FLASH 256GBIT PAR 48TSOP I |
|---|---|
| Quantity | 391 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 48-TSOP I | Memory Format | FLASH | Technology | FLASH - NAND (TLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Commercial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 48-TFSOP (0.724", 18.40mm Width) | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | OBSOLETE | HTS Code | N/A |
Overview of MT29F256G08EFEBBWP-M:B TR – IC FLASH 256GBIT PAR 48TSOP I
The MT29F256G08EFEBBWP-M:B TR is a 256 Gbit non-volatile FLASH memory device based on NAND (TLC) technology, organized as 32G × 8 with a parallel memory interface. It is supplied in a 48‑TSOP I package and operates from a 2.7 V to 3.6 V supply.
This device is suited to designs that require high-density parallel flash storage in a compact 48‑TFSOP (0.724", 18.40 mm width) footprint and that operate within a 0°C to 70°C ambient temperature range.
Key Features
- Memory Type & Technology Non-volatile FLASH using NAND (TLC) technology for high-density storage; memory size is 256 Gbit organized as 32G × 8.
- Interface Parallel memory interface for direct integration with parallel memory controllers.
- Power Wide supply voltage range of 2.7 V to 3.6 V to support common 3.3 V system rails.
- Package 48‑TFSOP / 48‑TSOP I package (0.724", 18.40 mm width) for board-level mounting in space-constrained layouts.
- Operating Temperature Rated for an ambient temperature range of 0°C to 70°C (TA).
- Memory Format & Mounting FLASH memory format with standard surface-mount TSOP packaging for PCB assembly.
Typical Applications
- Systems requiring high-density parallel flash — Designs that need 256 Gbit of non-volatile NAND flash with a parallel interface and a 48‑TSOP I package.
- Firmware and system image storage — Suitable where a 32G × 8 memory organization is used to store firmware or system images in parallel flash.
- Embedded devices operating at 0°C–70°C — Devices and assemblies that operate within the specified ambient temperature and 2.7 V–3.6 V supply range.
Unique Advantages
- High storage capacity: 256 Gbit of non-volatile FLASH provides significant on-board storage in a single device.
- Parallel interface simplicity: Parallel memory interface eases direct integration with parallel memory controllers and legacy designs.
- Compact TSOP footprint: 48‑TSOP I package (0.724", 18.40 mm width) supports dense PCB layouts while offering standard surface-mount assembly.
- Flexible power support: 2.7 V–3.6 V supply range aligns with common 3.3 V systems for straightforward power integration.
- TLC NAND density: NAND (TLC) technology enables higher bit density within the package for space-constrained applications.
Why Choose IC FLASH 256GBIT PAR 48TSOP I?
The MT29F256G08EFEBBWP-M:B TR positions itself as a high-density, parallel-interface NAND FLASH option for designs that require substantial non-volatile storage in a compact 48‑TSOP I package. Its 256 Gbit capacity and 32G × 8 organization provide a clear storage solution while the 2.7 V–3.6 V supply and 0°C–70°C operating range align with many common system environments.
This device is well suited to engineers and procurement teams seeking a single-device, high-capacity parallel flash memory solution that fits standard TSOP footprints and conventional 3.3 V power architectures, offering straightforward integration into existing PCB and controller designs.
Request a quote or contact sales to check pricing, availability, and lead times for the MT29F256G08EFEBBWP-M:B TR.
