MT29F32G08ABAAAM73A3WC1P

The MT29F32G08ABAAAM73A3WC1P is a 32 Gbit non-volatile NAND flash memory provided as a die. It implements NAND flash architecture with parallel interface organization (4G × 8) and is targeted at designs that require high-density, SLC-based persistent storage in a die form factor.

Designed for commercial temperature operation, the device supports both asynchronous and synchronous I/O modes and includes features for high-throughput data transfer, multi-plane operations and advanced flash commands for efficient block management and data movement.

Key Features

• Memory Type & Density  32 Gbit NAND flash organized as 4G × 8, delivered as a die package for direct integration into custom packages or modules.
• Cell Technology  Single-level cell (SLC) NAND for endurance and retention characteristics specified in the product datasheet.
• Interface Modes  Supports both asynchronous and synchronous I/O. Synchronous operation uses DQS strobes for data synchronization and supports up to synchronous timing mode 5.
• Performance Metrics  Synchronous read/write throughput up to 200 MT/s per pin (DDR clock rate 10 ns); asynchronous throughput up to 50 MT/s per pin. Typical array timings include read page 35 μs (max), program page 350 μs (typ), and erase block 1.5 ms (typ).
• Geometry & Organization  Page size (×8): 8,640 bytes (8,192 + 448); block = 128 pages; plane configuration: 2 planes × 2,048 blocks per plane; device-level block count for 32Gb = 4,096 blocks.
• Advanced Command Set  Includes program cache, read-cache (sequential and random), OTP mode, multi-plane commands, multi-LUN operations, read unique ID and copyback functions to optimize performance and data management.
• Power  Operating VCC range 2.7 V to 3.6 V. VCCQ options documented for I/O supply ranges (1.7–1.95 V or 2.7–3.6 V) to support different interface voltage schemes.
• Reliability & Endurance  Endurance rated at 80,000 program/erase cycles with data retention and qualification references noted in the datasheet (JESD47G compliance for data retention).
• Operational Requirements  Commercial operating temperature range 0 °C to +70 °C; RESET (FFh) required as first command after power-on. Operation status byte available for software detection of completion and status conditions.
• Package  Supplied as a die for flexible integration into custom assemblies; other package options for the family are documented in the datasheet.

Typical Applications

• Embedded Storage  High-density, non-volatile storage for embedded systems requiring SLC NAND in a die form factor.
• Consumer Electronics  Persistent data and firmware storage in commercial-temperature consumer devices that operate within the device’s 0 °C to 70 °C range.
• Data-Intensive Modules  Use in module-level designs or custom packages that require parallel NAND with multi-plane and cache programming features to optimize throughput.

Unique Advantages

• High-density die form  Provides 32 Gbit of NAND storage in a die package, enabling direct integration into custom modules and compact assemblies.
• SLC endurance  Single-level cell technology with 80,000 program/erase cycle endurance for applications that require higher write-cycle robustness.
• Flexible I/O modes  Both asynchronous and synchronous interfaces (with DQS support) allow designers to choose the timing and throughput profile that matches system requirements.
• Advanced flash management  Built-in support for program/read caches, multi-plane, multi-LUN operations and OTP facilitates efficient data movement and partitioning without external overhead.
• Voltage flexibility  VCC and VCCQ ranges documented to support common system power rails and I/O voltage configurations.

Why Choose MT29F32G08ABAAAM73A3WC1P?

The MT29F32G08ABAAAM73A3WC1P is positioned for designs that need a 32 Gbit SLC NAND solution in die form with documented endurance and array performance. Its support for synchronous and asynchronous modes, multi-plane operations and cache features makes it suitable for embedded storage implementations where throughput and reliable block management matter.

This device is suitable for commercial-temperature applications and provides a clear specification set for voltage, timing and endurance to support long-term design planning and system integration by engineers and procurement teams.

If you would like pricing, availability or technical clarification for integrating the MT29F32G08ABAAAM73A3WC1P into your design, request a quote or contact sales to discuss requirements and lead times.