MT29F256G08EECBBJ4-6:B
| Part Description |
IC FLASH 256GBIT PAR 132VBGA |
|---|---|
| Quantity | 894 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 132-VBGA (12x18) | Memory Format | FLASH | Technology | FLASH - NAND (TLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Commercial | ||
| Clock Frequency | 167 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 132-VBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | OBSOLETE | HTS Code | N/A |
Overview of MT29F256G08EECBBJ4-6:B – 256 Gbit Parallel NAND Flash, 132‑VBGA
The MT29F256G08EECBBJ4-6:B is a 256 Gbit non-volatile NAND flash memory device implemented in TLC technology and organized as 32G × 8. It provides parallel memory interfacing in a 132‑VBGA (12×18) package for designs that require high-density, board-mounted flash storage.
Key electrical and environmental parameters include a clock frequency of 167 MHz, a supply voltage range of 2.7 V to 3.6 V, and an ambient operating temperature range of 0°C to 70°C, making it suitable for systems designed to operate within those constraints.
Key Features
- Memory Type & Technology Non-volatile FLASH memory using NAND (TLC) technology for high-density, persistent storage.
- Capacity & Organization 256 Gbit capacity organized as 32G × 8 to support substantial on-board data and firmware storage.
- Interface & Performance Parallel memory interface with a specified clock frequency of 167 MHz for parallel-access designs.
- Power Operates from a 2.7 V to 3.6 V supply range to match common system voltage rails.
- Package 132‑VBGA (12×18) ball grid array package for compact, board-mounted integration.
- Operating Temperature Specified ambient temperature range is 0°C to 70°C for standard commercial-temperature applications.
Typical Applications
- Embedded storage systems — Provides high-density NAND flash storage where a parallel interface is required for data or firmware retention.
- Board-level mass storage — Serves as onboard non-volatile memory in designs that accommodate a 132‑VBGA package and require 256 Gbit capacity.
- Firmware and image storage — Retains system firmware, boot code, or large image assets within the device’s 32G × 8 organization.
- Systems with defined thermal and voltage envelopes — Intended for applications operating at 0°C–70°C and 2.7 V–3.6 V supply ranges.
Unique Advantages
- High-density storage: 256 Gbit capacity enables substantial on-board data and firmware storage without requiring additional components.
- Parallel interface compatibility: Parallel memory organization supports designs that use parallel-access memory architectures and timing.
- Compact VBGA package: 132‑VBGA (12×18) packaging provides a space-efficient form factor for board-mounted integration.
- Wide supply range: 2.7 V to 3.6 V operation aligns with common system power rails for simplified power design.
- Commercial temperature support: 0°C to 70°C operating range suits standard commercial applications.
Why Choose IC FLASH 256GBIT PAR 132VBGA?
The MT29F256G08EECBBJ4-6:B positions itself as a straightforward, high-capacity parallel NAND flash memory solution for designs requiring 256 Gbit of non-volatile storage in a 132‑VBGA package. Its specified clock frequency, supply-voltage range, and commercial operating temperature make it suitable for systems that adhere to those electrical and environmental constraints.
This device is a fit for designers and procurement teams targeting board-level implementations that need dense, parallel-access flash memory in a compact package, while retaining clear, verifiable electrical and thermal specifications for system integration.
Request a quote or submit a pricing inquiry to receive availability and lead-time information for the MT29F256G08EECBBJ4-6:B.
