MT29F32G08CBACAWP-IT:C TR

IC FLASH 32GBIT PAR 48TSOP I
Part Description

IC FLASH 32GBIT PAR 48TSOP I

Quantity 285 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package48-TSOP IMemory FormatFLASHTechnologyFLASH - NAND
Memory Size32 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging48-TFSOP (0.724", 18.40mm Width)
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization4G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F32G08CBACAWP-IT:C TR – IC FLASH 32GBIT PAR 48TSOP I

The MT29F32G08CBACAWP-IT:C TR is a 32 Gbit parallel NAND flash memory device organized as 4G × 8. It provides non-volatile storage in a parallel memory interface optimized for systems that require solid-state data or code storage.

Key device attributes include parallel NAND architecture, 2.7 V to 3.6 V supply range, and a 48-TSOP I package (0.724", 18.40 mm width) with an operating temperature range of −40 °C to 85 °C, supporting integration into board-level designs with those electrical and thermal requirements.

Key Features

  • Memory Type  Non-volatile NAND flash providing 32 Gbit total capacity organized as 4G × 8 for byte-oriented access.
  • Interface  Parallel memory interface for direct byte-wide connectivity to host controllers and memory buses.
  • Supply Voltage  Operates from 2.7 V to 3.6 V, supporting standard 3.3 V system rails and allowing flexibility in power-supply design.
  • Package  48-TSOP I package (0.724" / 18.40 mm width) suitable for compact board-level integration where a TSOP form factor is required.
  • Operating Temperature  Rated for −40 °C to 85 °C (TA), supporting deployment in environments within that ambient temperature range.
  • Memory Format  FLASH NAND technology designed for non-volatile storage applications.

Typical Applications

  • Parallel NAND storage Provides 32 Gbit of parallel NAND flash for systems that require direct parallel non-volatile memory.
  • Firmware and code storage Stores firmware or code images where a 4G × 8 organization and 32 Gbit capacity are required.
  • Board-level embedded storage Compact 48-TSOP I package enables integration into PCB designs that accept TSOP footprint and require the stated operating temperature and voltage range.

Unique Advantages

  • Large non-volatile capacity: 32 Gbit density provides substantial storage for code, data logs, or large firmware images without external memory stacking.
  • Parallel interface simplicity: Byte-wide parallel access simplifies interfacing with host controllers designed for parallel NAND devices.
  • Flexible power range: 2.7 V to 3.6 V operating range accommodates common 3.3 V system rails and slight variations in supply voltage.
  • Compact TSOP package: 48-TSOP I (0.724" / 18.40 mm) balances board-space efficiency with ease of placement for surface-mount assembly.
  • Extended ambient temperature: −40 °C to 85 °C rating supports deployment across a wide range of environmental conditions within that range.

Why Choose IC FLASH 32GBIT PAR 48TSOP I?

The MT29F32G08CBACAWP-IT:C TR delivers a straightforward parallel NAND flash solution when a 32 Gbit non-volatile memory, 4G × 8 organization, and TSOP package are required. Its electrical and thermal specifications—2.7 V to 3.6 V supply and −40 °C to 85 °C operation—make it suitable for designs that must meet those specific constraints.

This device is appropriate for designs that need a high-density parallel flash memory in a compact 48-TSOP I footprint, enabling predictable board-level integration and capacity planning for embedded storage or firmware applications.

If you need pricing, availability, or a formal quote for MT29F32G08CBACAWP-IT:C TR, request a quote or submit an inquiry to receive further details and assistance.

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