MT29F32G08CBACAWP-Z:C

IC FLASH 32GBIT PAR 48TSOP I
Part Description

IC FLASH 32GBIT PAR 48TSOP I

Quantity 1,841 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package48-TSOP IMemory FormatFLASHTechnologyFLASH - NAND
Memory Size32 GbitAccess TimeN/AGradeCommercial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging48-TFSOP (0.724", 18.40mm Width)
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization4G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F32G08CBACAWP-Z:C – IC FLASH 32GBIT PAR 48TSOP I

The MT29F32G08CBACAWP-Z:C is a non-volatile NAND FLASH memory device providing 32 Gbit of parallel-access storage. It implements a 4G × 8 memory organization and is supplied in a 48‑TSOP I package.

This device is intended for designs that require solid-state, persistent storage with a parallel memory interface, standard TSOP packaging, and single-supply operation within the specified voltage and temperature ranges.

Key Features

  • Memory Type & Technology Non-volatile FLASH NAND memory providing persistent data storage without continuous power.
  • Capacity & Organization 32 Gbit capacity organized as 4G × 8 for byte-wide parallel access.
  • Interface Parallel memory interface for direct connection to parallel memory controllers and systems supporting parallel FLASH.
  • Supply Voltage Operates from 2.7 V to 3.6 V, supporting common single-supply system domains.
  • Package 48‑TSOP I (48‑TFSOP, 0.724" / 18.40 mm width) offering a compact footprint for high-density boards.
  • Operating Temperature Rated for 0°C to 70°C (TA), suitable for standard commercial temperature environments.
  • Memory Format FLASH format designed for persistent storage of code, data, or system images.

Typical Applications

  • Persistent storage — Provides 32 Gbit of NAND FLASH for systems requiring non-volatile data retention and bulk storage.
  • Code and firmware storage — Stores firmware or system images in designs that use parallel FLASH memory mapping.
  • Embedded system memory — Suitable for embedded devices and modules that integrate parallel FLASH in a compact TSOP footprint.

Unique Advantages

  • High-density storage in a compact package: 32 Gbit capacity delivered in a 48‑TSOP I package to save board area while providing substantial non-volatile memory.
  • Byte-wide parallel organization: 4G × 8 organization enables straightforward byte-wise access for systems using parallel memory interfaces.
  • Standard supply compatibility: 2.7 V–3.6 V operation aligns with common single-supply system voltages for easier integration.
  • Commercial temperature rating: Rated 0°C to 70°C for applications operating in standard commercial environments.
  • FLASH memory format: Non-volatile FLASH technology supports persistent storage of code and data without continuous power.

Why Choose IC FLASH 32GBIT PAR 48TSOP I?

The MT29F32G08CBACAWP-Z:C positions itself as a straightforward, high-capacity parallel NAND FLASH option for designs requiring persistent storage in a compact TSOP form factor. Its 32 Gbit density, byte-wide 4G × 8 organization, and 2.7 V–3.6 V supply make it suitable for systems that employ parallel FLASH memory mapping and standard commercial operating conditions.

This device is well suited for engineers and procurement teams looking for a verified FLASH memory component that balances storage density, package compactness, and standard voltage/temperature ranges for long-term deployment in commercial products.

If you would like a formal quote or additional purchasing information for MT29F32G08CBACAWP-Z:C, please submit a request and our team will respond with pricing and availability.

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