MT29F64G08AECABH1-10IT:A TR

IC FLASH 64GBIT PARALLEL 100VBGA
Part Description

IC FLASH 64GBIT PARALLEL 100VBGA

Quantity 588 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-VBGA (12x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeIndustrial
Clock Frequency100 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging100-VBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F64G08AECABH1-10IT:A TR – IC FLASH 64GBIT PARALLEL 100VBGA

The MT29F64G08AECABH1-10IT:A TR is a 64 Gbit parallel NAND flash memory device using single-level cell (SLC) technology and organized as 8G × 8. The device supports both asynchronous and synchronous I/O modes and implements ONFI 2.2‑compliant features for parallel NAND operation.

This part is designed for board‑level integration in a 100‑VBGA (12 × 18) package and supports industrial operating temperatures (‑40°C to +85°C) with a supply voltage range of 2.7 V to 3.6 V. It is suited to applications that require non‑volatile parallel NAND storage with robust endurance and explicit array control features.

Key Features

  • Core & Architecture Single‑level cell (SLC) NAND flash with device organization of 8G × 8 and a 64 Gbit device size.
  • Memory Organization Page size x8: 8,640 bytes (8,192 + 448 bytes); block size: 128 pages; plane architecture with device block counts consistent with the 64Gb density.
  • Interface & Protocol Parallel NAND interface with ONFI 2.2 compliance and support for asynchronous and synchronous I/O timing modes, including DQS data‑strobe signals for synchronous data synchronization.
  • Performance Synchronous I/O read/write throughput per pin up to 200 MT/s and asynchronous throughput per pin up to 50 MT/s as defined for the device family; clocking and timing modes support high‑speed synchronous operation.
  • Power & Voltage Operating VCC range of 2.7 V to 3.6 V and support for VCCQ voltage selections as specified in the device family documentation.
  • Package & Mounting 100‑ball BGA (100‑VBGA) package, supplier device package specified as 100‑VBGA (12 × 18) for compact board integration.
  • Temperature & Reliability Industrial operating temperature range of ‑40°C to +85°C; endurance rated at 60,000 program/erase cycles and data retention qualified to JESD47G as indicated in the device family documentation.
  • Advanced Command Set & Array Features Supports program cache, read cache (sequential and random), multi‑plane commands, multi‑LUN operations, copyback, OTP mode, and read unique ID operations for flexible flash management.

Typical Applications

  • Industrial systems — Non‑volatile parallel NAND storage for controllers and equipment that require operation across an industrial temperature range (‑40°C to +85°C).
  • Embedded storage — On‑board flash memory for embedded platforms that need parallel NAND with SLC endurance characteristics and block/page architecture for managed storage.
  • Custom hardware controllers — Board‑level integration in systems using a 100‑VBGA footprint and parallel NAND interface for direct array access and advanced command support.

Unique Advantages

  • Industrial temperature rating: The device supports ‑40°C to +85°C operation, enabling deployment in temperature‑sensitive environments.
  • SLC endurance: Endurance of 60,000 program/erase cycles provides a predictable lifecycle for write‑intensive applications.
  • Flexible I/O modes: ONFI 2.2 compliance and support for synchronous/asynchronous modes with DQS strobe enable accurate timing and improved data throughput in synchronous operation.
  • Large page and block architecture: 8,640‑byte pages and 128‑page blocks help optimize sequential transfers and block management for high‑capacity storage.
  • Compact BGA package: 100‑VBGA (12 × 18) package provides a small board footprint for high‑density designs.
  • Comprehensive command feature set: Program/read caches, multi‑plane and multi‑LUN commands, and copyback operations support efficient flash management and parallelism.

Why Choose MT29F64G08AECABH1-10IT:A TR?

The MT29F64G08AECABH1-10IT:A TR delivers a parallel SLC NAND solution that combines industrial temperature capability, proven endurance, and advanced ONFI‑compliant features for controlled, high‑throughput flash operation. Its 64 Gbit density, large page/block geometry, and 100‑VBGA package make it suitable for embedded and industrial board‑level storage applications where predictable lifecycle and explicit NAND control are required.

This device is a fit for designers and systems integrators needing parallel NAND memory with explicit array and command support, industrial thermal range, and a compact BGA footprint for integration into custom hardware and embedded platforms.

Request a quote or contact sales to discuss availability, lead times, and pricing for MT29F64G08AECABH1-10IT:A TR.

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