MT29F64G08AECABH1-10Z:A
| Part Description |
IC FLASH 64GBIT PARALLEL 100VBGA |
|---|---|
| Quantity | 218 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-VBGA (12x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Commercial | ||
| Clock Frequency | 100 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 100-VBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MT29F64G08AECABH1-10Z:A – IC FLASH 64GBIT PARALLEL 100VBGA
The MT29F64G08AECABH1-10Z:A is a 64 Gbit parallel NAND flash memory device in a 100-ball VBGA (12×18) package. It implements single-level cell (SLC) NAND architecture with an 8G × 8 memory organization and supports both asynchronous and synchronous I/O modes.
This device is intended for applications requiring high-density non-volatile storage with a parallel interface, offering on-die features such as ONFI 2.2 protocol support, multi-plane operations, and program/read caching to optimize throughput and system integration.
Key Features
- Memory Capacity & Organization — 64 Gbit density organized as 8G × 8, supporting large non-volatile storage in a single device.
- Technology — SLC NAND flash memory providing the device’s non-volatile storage capabilities and endurance characteristics.
- Interface & Protocol — Parallel memory interface with ONFI 2.2-compliant command set, supporting asynchronous and synchronous I/O modes.
- Performance — Synchronous mode supports up to DDR timing (read/write throughput per pin up to 200 MT/s); asynchronous mode throughput up to 50 MT/s; typical read page, program page, and erase block times are provided in the device datasheet.
- Clock & Timing — Designed to operate with a clock supporting up to 100 MHz (specification present in product data).
- Voltage — VCC operating range 2.7 V to 3.6 V; VCCQ options include 1.7–1.95 V and 2.7–3.6 V as documented in the datasheet.
- Endurance & Reliability — Endurance specified at 60,000 program/erase cycles; data retention and qualification references are provided in the device documentation.
- Advanced Command & Array Features — Program cache, read cache (sequential and random), copyback, multi-plane commands, multi-LUN operations, OTP mode, and read unique ID support.
- Package & Temperature — Supplied in a 100-ball BGA (100-VBGA, 12×18) package; operating temperature specified as 0°C to 70°C (TA) for the listed part.
Typical Applications
- Embedded Storage — Non-volatile storage for embedded systems requiring mid-density NAND in a compact BGA package.
- Consumer Electronics — Local flash storage for devices that integrate parallel NAND for firmware, caching, or user data.
- Data-Intensive Subsystems — Storage arrays and controllers that leverage multi-plane and cache features for improved throughput.
- Industrial Equipment (Commercial Temperature Range) — Systems operating within 0°C to 70°C that need reliable SLC NAND endurance and data retention.
Unique Advantages
- ONFI 2.2 Compliance: Standardized protocol support simplifies integration with ONFI-capable controllers and host interfaces.
- SLC Endurance: 60,000 program/erase cycles provide longevity for applications with frequent write/erase activity.
- Flexible I/O Modes: Asynchronous and synchronous operation with DQS strobe support enables designers to optimize for latency or throughput.
- Advanced Array Commands: Multi-plane, multi-LUN, and cache/program features help maximize effective throughput and parallelism within the device.
- Compact BGA Footprint: 100-ball VBGA (12×18) package reduces PCB area while supporting high-density integration.
- Wide Supply Range: VCC 2.7–3.6 V and selectable VCCQ options allow compatibility with common system voltage domains.
Why Choose IC FLASH 64GBIT PARALLEL 100VBGA?
The MT29F64G08AECABH1-10Z:A positions itself as a high-density SLC NAND solution for designs that require reliable non-volatile storage with flexible parallel I/O. Its ONFI 2.2 support, multi-plane and cache features, and documented endurance characteristics make it suitable for systems where predictable program/erase longevity and controllable throughput are important.
This device is appropriate for engineers designing embedded storage subsystems, consumer devices, or data-handling modules operating within the commercial temperature range, who value standardized protocol support and a compact BGA package for PCB real estate efficiency.
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