MT29F64G08AECABH1-10IT:A
| Part Description |
IC FLASH 64GBIT PARALLEL 100VBGA |
|---|---|
| Quantity | 269 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-VBGA (12x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 100 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 100-VBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MT29F64G08AECABH1-10IT:A – IC FLASH 64GBIT PARALLEL 100VBGA
The MT29F64G08AECABH1-10IT:A is a 64 Gbit non-volatile NAND flash memory device from Micron Technology Inc., organized as 8G × 8 in a parallel interface. It implements NAND FLASH technology with single-level cell (SLC) architecture and supports both asynchronous and synchronous I/O modes.
This device is designed for designs that require high-density parallel NAND storage with robust endurance and a compact 100-ball VBGA package. Key electrical and timing characteristics include a 2.7–3.6 V supply range and a 100 MHz clock rate for synchronous operation.
Key Features
- Memory Technology NAND Flash (SLC). Single-level cell architecture as specified in the datasheet for the device family.
- Density & Organization 64 Gbit total capacity, organized as 8G × 8. Device-level organization specifies 8192 blocks for the 64Gb density.
- Interface & Protocol Parallel memory interface with ONFI 2.2-compliant features and support for both asynchronous and synchronous I/O modes. Includes DQS data strobe support for synchronous data synchronization and multi-plane/multi-LUN command support.
- Performance Synchronous operation supports high-rate transfers (read/write throughput per pin up to 200 MT/s in synchronous mode); asynchronous throughput up to 50 MT/s. Reported array timings include read page (max 35 μs), program page (typical 350 μs) and erase block (typical 1.5 ms).
- Clock & Timing Clock frequency specified at 100 MHz; synchronous timing modes supported up to mode 5 as defined in the product documentation.
- Power Operating VCC: 2.7–3.6 V. VCCQ options documented in the device family include 1.7–1.95 V or 2.7–3.6 V operation.
- Endurance & Data Reliability Endurance rating of 60,000 program/erase cycles and data retention meeting JESD47G compliance as noted in the datasheet.
- Package & Temperature 100-ball VBGA package (12 × 18 mm footprint) and industrial operating temperature range of –40 °C to +85 °C (TA).
Unique Advantages
- High-density SLC storage in a compact package: 64 Gbit capacity in a 100-ball VBGA (12×18) allows high storage density with a small board footprint.
- Flexible I/O operation: Support for both asynchronous and synchronous modes, including DQS strobe signals, enables designers to choose the timing model that matches system requirements.
- ONFI 2.2 compatibility: ONFI-compliant features simplify integration with host controllers that support the ONFI protocol family.
- Predictable array performance: Documented read, program and erase latencies provide clear parameters for system-level performance budgeting.
- Industrial temperature range and robust endurance: –40 °C to +85 °C operation and 60,000 program/erase cycles provide stability for temperature-variable environments and long-term use cases.
Why Choose MT29F64G08AECABH1-10IT:A?
The MT29F64G08AECABH1-10IT:A combines high-density SLC NAND storage, flexible synchronous/asynchronous interfaces, and documented endurance and timing characteristics to serve designs that require reliable, compact non-volatile memory. Its 100-ball VBGA package and industrial temperature rating make it suitable where board space and environmental range are key considerations.
This Micron NAND device is suited to engineers specifying deterministic read/program/erase parameters, ONFI-compatible interfaces, and established endurance/retention metrics. It offers a clear technical profile for integration, long-term use, and system-level performance planning.
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