MT29F64G08CBCGBJ4-5M:G TR

IC FLASH 64GBIT PAR 132VBGA
Part Description

IC FLASH 64GBIT PAR 132VBGA

Quantity 1,548 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package132-VBGA (12x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeCommercial
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging132-VBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F64G08CBCGBJ4-5M:G TR – IC FLASH 64Gbit Parallel 132‑VBGA

The MT29F64G08CBCGBJ4-5M:G TR is a 64 Gbit non-volatile NAND flash memory device provided in a 132‑ball VBGA package (12×18). It implements parallel NAND flash architecture with an 8G × 8 memory organization and supports a 200 MHz clock frequency.

This device is intended for system designs that require high-density, parallel-interface flash storage within a compact VBGA package and operating from a 2.7 V to 3.6 V supply range.

Key Features

  • Memory Type and Architecture  Non-volatile NAND flash memory organized as 8G × 8, providing a total capacity of 64 Gbit.
  • Interface  Parallel memory interface for integration with systems that support parallel NAND connectivity.
  • Performance  Supports a 200 MHz clock frequency for synchronous operation.
  • Power  Operates from a single supply voltage range of 2.7 V to 3.6 V.
  • Package  Supplied in a 132‑VBGA package (12×18 mm), offering a compact footprint for board-level integration.
  • Operating Temperature  Rated for commercial temperature operation from 0 °C to 70 °C (TA).

Typical Applications

  • Embedded storage  Use as onboard non-volatile storage in systems that require parallel NAND flash memory.
  • Firmware and code storage  Storage of system firmware and boot code where a parallel flash interface is employed.
  • Data logging  On-device data retention and logging in applications operating within the specified temperature and voltage ranges.

Unique Advantages

  • High storage density: 64 Gbit capacity in a single device supports larger code and data storage needs without multiple components.
  • Parallel interface compatibility: Parallel NAND interface simplifies integration into legacy or parallel-oriented system architectures.
  • Compact VBGA package: 132‑VBGA (12×18) package enables space-efficient board designs.
  • Flexible supply range: 2.7 V to 3.6 V operation accommodates common system power rails.
  • Commercial temperature rating: 0 °C to 70 °C operation aligns with standard commercial applications.
  • Defined timing: 200 MHz clock frequency support provides a clear timing reference for system design.

Why Choose IC FLASH 64GBIT PAR 132VBGA?

The MT29F64G08CBCGBJ4-5M:G TR positions itself as a high-density parallel NAND flash option for designers needing 64 Gbit of non-volatile storage in a compact 132‑VBGA package. Its defined electrical and timing characteristics—2.7 V to 3.6 V supply, 200 MHz clock, and 0 °C to 70 °C operating range—make it suitable for commercial systems that require reliable parallel flash integration.

This device is appropriate for engineers and procurement teams seeking a single-component storage solution that simplifies board layout, maintains a small footprint, and provides a clear electrical and mechanical specification set for integration and long-term production planning.

Request a quote or contact sales to inquire about availability, pricing, and lead times for the MT29F64G08CBCGBJ4-5M:G TR.

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