MT29F64G08CBCBBH1-10X:B

IC FLASH 64GBIT PARALLEL 100VBGA
Part Description

IC FLASH 64GBIT PARALLEL 100VBGA

Quantity 128 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-VBGA (12x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeCommercial
Clock Frequency100 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging100-VBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization8G x 8
Moisture Sensitivity LevelN/ARoHS ComplianceUnknownREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F64G08CBCBBH1-10X:B – IC FLASH 64GBIT PARALLEL 100VBGA

The MT29F64G08CBCBBH1-10X:B is a 64 Gbit NAND flash memory device in a parallel memory organization (8G × 8). It implements non-volatile FLASH NAND technology and is supplied in a compact 100‑VBGA (12×18) package.

Designed for systems that require parallel NAND non-volatile storage, the device operates at a clock frequency of 100 MHz and supports a 2.7 V to 3.6 V supply voltage with an ambient operating temperature range of 0 °C to 70 °C.

Key Features

  • Memory Core 64 Gbit capacity organized as 8G × 8 using FLASH – NAND technology for non-volatile storage.
  • Interface and Performance Parallel memory interface with a specified clock frequency of 100 MHz to support synchronous parallel access patterns.
  • Power Supports a supply voltage range of 2.7 V to 3.6 V, enabling compatibility with common 3 V system power rails.
  • Package Supplied in a 100‑VBGA (12×18) package, offering a compact footprint for board-level integration.
  • Operating Conditions Rated for ambient operation from 0 °C to 70 °C (TA), suitable for commercial-temperature environments.

Typical Applications

  • Non-volatile storage systems — Provides 64 Gbit parallel NAND flash capacity for systems that require persistent data storage.
  • Embedded system memory — Used where parallel FLASH memory and a 2.7 V–3.6 V supply are required.
  • Space-constrained designs — The 100‑VBGA (12×18) package supports compact board layouts that need high-density memory.

Unique Advantages

  • High-density 64 Gbit capacity: Enables large non-volatile storage within a single device, reducing component count.
  • Parallel interface at 100 MHz: Supports parallel access patterns with a specified clock rate for predictable timing integration.
  • Wide supply voltage support: 2.7 V to 3.6 V compatibility simplifies integration with standard 3 V system rails.
  • Compact VBGA package: 100‑VBGA (12×18) packaging minimizes PCB space while providing the required I/O density.
  • Commercial temperature rating: Specified operation from 0 °C to 70 °C for typical commercial environments.
  • Manufacturer: Produced by Micron Technology Inc., a recognized supplier of memory devices.

Why Choose IC FLASH 64GBIT PARALLEL 100VBGA?

The MT29F64G08CBCBBH1-10X:B combines 64 Gbit NAND flash capacity, a parallel interface at 100 MHz, and a compact 100‑VBGA (12×18) footprint to meet design requirements for high-density non-volatile storage with predictable electrical and thermal parameters. Its 2.7 V–3.6 V supply range and commercial temperature rating make it suitable for a wide range of general-purpose applications that need parallel FLASH memory.

This device is suitable for designers and procurement teams specifying parallel NAND memory where device-level capacity, package footprint, and standard voltage compatibility are the primary selection criteria. Choosing a Micron-manufactured part supports continuity with an established memory supplier.

Request a quote or contact sales to discuss availability, lead times, and pricing for MT29F64G08CBCBBH1-10X:B.

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