MT46V16M16P-5B XIT:M TR

IC DRAM 256MBIT PARALLEL 66TSOP
Part Description

IC DRAM 256MBIT PARALLEL 66TSOP

Quantity 270 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOPMemory FormatDRAMTechnologySDRAM - DDR
Memory Size256 MbitAccess Time700 psGradeIndustrial
Clock Frequency200 MHzVoltage2.5V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0036

Overview of MT46V16M16P-5B XIT:M TR – IC DRAM 256MBIT PARALLEL 66TSOP

The MT46V16M16P-5B XIT:M TR is a 256 Mbit DDR DRAM device organized as 16M × 16 with a parallel memory interface. It implements DDR SDRAM architecture and is specified with a 200 MHz clock frequency, making it suitable for designs that require on-board parallel DDR memory in a 66-TSSOP package.

Key electrical and mechanical attributes include a 2.5 V–2.7 V supply range, 700 ps access time, a 15 ns write cycle time (word/page), and an operating temperature range of −40°C to 85°C (TA), enabling integration into systems with defined timing and environmental requirements.

Key Features

  • Memory Core  256 Mbit DRAM organized as 16M × 16 for parallel data paths.
  • Technology & Interface  DDR SDRAM technology with a parallel memory interface to match parallel bus architectures.
  • Performance  200 MHz clock frequency and 700 ps access time; write cycle time (word/page) of 15 ns for deterministic timing.
  • Voltage Supply  Operates from 2.5 V to 2.7 V, matching common DDR I/O supply ranges for compatible systems.
  • Package  66-TSSOP (0.400", 10.16 mm width) provides a compact, surface-mount footprint.
  • Operating Temperature  Specified for −40°C to 85°C (TA) to cover extended ambient conditions.
  • Memory Format & Mounting  Volatile DRAM device intended for surface-mount mounting in parallel memory applications.

Unique Advantages

  • Density and Organization: 256 Mbit capacity in a 16M × 16 organization provides defined data width for parallel bus designs.
  • Deterministic Timing: 200 MHz clock, 700 ps access time, and 15 ns write cycle time support predictable memory timing requirements.
  • Industry-Standard Supply Range: 2.5 V–2.7 V supply simplifies integration with systems using standard DDR voltage levels.
  • Compact Surface-Mount Package: 66-TSSOP (10.16 mm width) enables high-density board designs while retaining a parallel interface.
  • Extended Temperature Range: −40°C to 85°C (TA) offers suitability for applications with wider ambient temperature demands.

Why Choose IC DRAM 256MBIT PARALLEL 66TSOP?

The MT46V16M16P-5B XIT:M TR positions itself as a straightforward DDR SDRAM option where 256 Mbit capacity, parallel interface, and defined timing are required. Its combination of 16M × 16 organization, 200 MHz clock specification, and compact 66-TSSOP package supports designs that need a predictable, board-mountable DDR memory element.

Engineers selecting this device benefit from its explicit electrical and mechanical specifications—voltage range 2.5 V–2.7 V, access time and cycle timing values, and an extended operating temperature range—helping to simplify component selection for systems with these defined requirements.

Request a quote or submit an inquiry to check availability and pricing for the MT46V16M16P-5B XIT:M TR.

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