MT46V16M16P-5B XIT:M

IC DRAM 256MBIT PARALLEL 66TSOP
Part Description

IC DRAM 256MBIT PARALLEL 66TSOP

Quantity 175 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOPMemory FormatDRAMTechnologySDRAM - DDR
Memory Size256 MbitAccess Time700 psGradeIndustrial
Clock Frequency200 MHzVoltage2.5V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT46V16M16P-5B XIT:M – IC DRAM 256MBIT PARALLEL 66TSOP

The MT46V16M16P-5B XIT:M is a 256 Mbit volatile DRAM offered by Micron Technology Inc. It implements DDR SDRAM architecture with a 16M × 16 memory organization and a parallel memory interface.

Designed to deliver measurable timing and voltage characteristics, the device operates at a 200 MHz clock frequency with a 700 ps access time, supports a 2.5 V–2.7 V supply range, and is packaged in a 66-TSSOP (0.400", 10.16 mm width) case with an operating temperature range of -40°C to 85°C.

Key Features

  • Memory Type & Architecture Volatile DRAM using SDRAM - DDR technology; organized as 16M × 16 to provide a total memory size of 256 Mbit.
  • Performance 200 MHz clock frequency and 700 ps access time; write cycle time (word page) specified at 15 ns.
  • Interface Parallel memory interface for conventional parallel DRAM system integration.
  • Voltage Supply voltage range of 2.5 V to 2.7 V.
  • Package 66-TSSOP (0.400", 10.16 mm width) supplier device package.
  • Operating Temperature Specified operating temperature range of -40°C to 85°C (TA).

Unique Advantages

  • 256 Mbit capacity in a 16M × 16 organization: Provides a clearly defined memory footprint for designs requiring this density and data width.
  • DDR SDRAM timing: 200 MHz clock frequency and 700 ps access time support deterministic timing characteristics for system memory operations.
  • Standard supply domain: Operates within a 2.5 V–2.7 V range consistent with the device's DDR voltage requirements.
  • Compact 66-TSSOP package: Supplied in a 66-TSSOP (0.400", 10.16 mm) package for board-level placement where that footprint is required.
  • Extended temperature range: Rated for -40°C to 85°C (TA) to accommodate applications requiring wider ambient temperature tolerance.
  • Defined write-cycle timing: Word page write cycle time specified at 15 ns for predictable write performance.

Why Choose IC DRAM 256MBIT PARALLEL 66TSOP?

The MT46V16M16P-5B XIT:M positions itself as a straightforward, specification-driven DDR SDRAM option for designs that require a 256 Mbit parallel memory with defined timing and voltage characteristics. Its combination of 16M × 16 organization, 200 MHz clocking, and 700 ps access time provides clear electrical and timing parameters for system integration.

Offered by Micron Technology Inc. in a 66-TSSOP package and rated for -40°C to 85°C, the device is suitable for applications that require the stated memory density, parallel interface, and supply/temperature ranges. The explicit timing and voltage specifications help designers plan interface and power architectures with measurable parameters.

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