MT46V32M16P-75:C
| Part Description |
IC DRAM 512MBIT PARALLEL 66TSOP |
|---|---|
| Quantity | 133 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 66-TSOP | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 750 ps | Grade | Commercial | ||
| Clock Frequency | 133 MHz | Voltage | 2.3V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 66-TSSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 4 (72 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of MT46V32M16P-75:C – IC DRAM 512MBIT PARALLEL 66TSOP
The MT46V32M16P-75:C is a 512 Mbit DDR SDRAM organized as 32M × 16 with a parallel memory interface. It provides synchronous DRAM operation with a 133 MHz clock frequency and an access time of 750 ps.
This device is supplied in a 66-TSSOP (10.16 mm width) package, operates from 2.3 V to 2.7 V, and is specified for an ambient temperature range of 0°C to 70°C. Its write cycle time (word page) is 15 ns, making it suitable for designs that require a compact, parallel DDR memory element within those electrical and thermal limits.
Key Features
- Core / Memory Architecture 512 Mbit capacity organized as 32M × 16; parallel DDR SDRAM architecture for synchronous data transfers.
- Performance 133 MHz clock frequency and 750 ps access time deliver predictable timing for parallel memory systems; write cycle time (word page) is 15 ns.
- Power Operates from a 2.3 V to 2.7 V supply range, matching common low-voltage DDR memory rails.
- Package Available in a 66-TSSOP package (0.400" / 10.16 mm width) for compact board-level integration.
- Operating Environment Specified for ambient temperatures from 0°C to 70°C (TA), suitable for commercial-temperature applications.
- Interface Parallel memory interface compatible with systems designed for 16-bit-wide DDR connections.
Typical Applications
- 16-bit Parallel Memory Implementations Use as a 32M × 16 DDR memory device where a 16-bit parallel data path and 512 Mbit density are required.
- Compact Board-Level Designs Suited to designs constrained to a 66-TSSOP package footprint (10.16 mm width).
- Low-Voltage DDR Systems Applicable where a 2.3 V–2.7 V memory supply is mandated.
- Commercial-Temperature Electronics Fits systems that operate within a 0°C to 70°C ambient temperature range.
Unique Advantages
- 512 Mbit, 32M × 16 Organization: Provides a defined density and data width for predictable memory mapping and system budgeting.
- Synchronous DDR Operation at 133 MHz: Enables timing-aligned transfers with a documented clock frequency and 750 ps access time.
- Low-Voltage Supply Range: 2.3 V–2.7 V operation supports common low-voltage DDR power domains.
- Compact 66-TSSOP Package: Small outline package helps conserve PCB area while maintaining a 16-bit parallel interface.
- Commercial Temperature Rating: Specified 0°C to 70°C ambient range for standard electronic applications.
Why Choose IC DRAM 512MBIT PARALLEL 66TSOP?
The MT46V32M16P-75:C delivers a defined 512 Mbit DDR SDRAM solution with a 32M × 16 organization, a 133 MHz clock, and documented timing (750 ps access time, 15 ns write cycle). Its 2.3 V–2.7 V supply range and 66-TSSOP packaging make it a compact option for systems that require a parallel 16-bit DDR memory with commercial-temperature operation.
This device is appropriate for designs that require explicit electrical and thermal specifications and a known package footprint, offering straightforward integration into systems that match its voltage, timing, and temperature parameters.
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