MT46V32M16TG-5B IT:J

IC DRAM 512MBIT PAR 66TSOP II
Part Description

IC DRAM 512MBIT PAR 66TSOP II

Quantity 1,530 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time4 Weeks
Datasheet

Specifications & Environmental

Device Package66-TSOP IIMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeIndustrial
Clock Frequency200 MHzVoltage2.5V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of MT46V32M16TG-5B IT:J - 512Mbit DDR SDRAM in 66-TSOP II Package

The MT46V32M16TG-5B IT:J from Alliance Memory is a 512Mbit DDR SDRAM device organized as 32M x 16, delivering high-speed memory solutions for embedded systems and industrial applications. Operating at 200MHz with 0.7ns access time, this parallel interface DRAM provides reliable performance across extended temperature ranges from -40°C to 85°C, making it suitable for demanding environments where standard consumer-grade memory may not suffice.

Key Features

  • Memory Configuration - 512Mbit total capacity organized as 32M x 16-bit words, optimized for applications requiring moderate memory density with a 16-bit data path.
  • DDR SDRAM Technology - Double Data Rate architecture transfers data on both rising and falling clock edges at 200MHz, providing enhanced bandwidth compared to single data rate memories.
  • Power Supply - Operates on 2.5V to 2.7V supply voltage, offering lower power consumption suitable for battery-operated and power-sensitive designs.
  • Extended Temperature Range - Rated for -40°C to 85°C ambient operation, ensuring reliable performance in industrial control systems, automotive infotainment, and outdoor equipment.
  • Parallel Interface - Direct memory access through parallel bus architecture provides deterministic latency and straightforward integration with microcontrollers and processors supporting standard DDR protocols.
  • Package Format - Available in 66-pin TSOP II package with 10.16mm width, offering a compact footprint with established manufacturing compatibility.

Typical Applications

  • Industrial Control Systems - This SDRAM provides working memory for PLCs, motion controllers, and HMI panels where the extended temperature rating ensures consistent operation in factory floor environments subject to temperature variation.
  • Networking Equipment - Serves as buffer memory in routers, switches, and access points where the 200MHz DDR interface supports packet processing and routing table storage with predictable latency characteristics.
  • Automotive Infotainment - Functions as display buffer and application memory in dashboard systems and rear-seat entertainment where the industrial temperature range accommodates in-cabin thermal conditions.
  • Medical Instrumentation - Acts as data acquisition buffer and image storage in diagnostic equipment where reliable operation across temperature ranges supports varied clinical and laboratory settings.
  • Test and Measurement - Provides capture memory for oscilloscopes, logic analyzers, and data loggers where parallel access patterns align with high-speed data acquisition requirements.

Unique Advantages

  • Extended Temperature Qualification: The -40°C to 85°C operating range eliminates the need for thermal management solutions in many industrial applications, reducing overall BOM cost and design complexity.
  • Established DDR Architecture: Standards-based DDR SDRAM interface ensures broad controller support and reduces firmware development effort compared to proprietary memory architectures.
  • Active Lifecycle Status: Long-term availability supports designs with extended product lifecycles common in industrial and infrastructure equipment where component obsolescence poses significant risk.
  • Compact Package Footprint: The 66-TSOP II form factor provides space-efficient PCB layout while maintaining compatibility with standard assembly processes and inspection methods.
  • Moderate Density Point: The 512Mbit capacity serves applications requiring more memory than lower-density devices while avoiding the cost premium of multi-gigabit components.
  • Low Voltage Operation: 2.5V supply voltage reduces power dissipation and thermal load compared to legacy 3.3V memories, supporting fanless and sealed enclosure designs.

Why Choose MT46V32M16TG-5B IT:J?

This DDR SDRAM is positioned for industrial and embedded applications where extended temperature capability, moderate memory density, and long-term component availability align with system requirements. The 32M x 16 organization suits processors and controllers with 16-bit data buses, while the 200MHz DDR interface provides sufficient bandwidth for control systems, data acquisition, and communication applications without the complexity of higher-speed memory technologies.

Engineers selecting this component benefit from Alliance Memory's focus on legacy and industrial memory solutions, which supports designs requiring predictable long-term sourcing. The combination of industrial temperature rating, established DDR protocol support, and compact packaging addresses requirements common in equipment with 10+ year operational lifetimes.

Get a Quote

Contact our sales team to discuss your memory requirements and receive detailed pricing for the MT46V32M16TG-5B IT:J. Our technical support staff can assist with integration guidance, reference designs, and volume availability to support your development schedule.

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