MT46V32M16P-75 L:C

IC DRAM 512MBIT PARALLEL 66TSOP
Part Description

IC DRAM 512MBIT PARALLEL 66TSOP

Quantity 694 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOPMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time750 psGradeCommercial
Clock Frequency133 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level4 (72 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT46V32M16P-75 L:C – IC DRAM 512MBIT PARALLEL 66TSOP

The MT46V32M16P-75 L:C is a 512 Mbit DDR SDRAM device organized as 32M × 16 with a parallel memory interface. It provides DDR SDRAM architecture with a 133 MHz clock frequency intended for systems that require volatile high-density memory in a compact 66-TSSOP package.

Designed for engineers specifying a 512 Mbit parallel DRAM solution, the device offers defined timing characteristics, a low-voltage supply range, and a commercial operating temperature range for integration into board-level designs.

Key Features

  • Core / Memory Architecture DDR SDRAM technology organized as 32M × 16, providing a total memory size of 512 Mbit in a parallel DRAM format.
  • Performance 133 MHz clock frequency with an access time of 750 ps and a write cycle time (word page) of 15 ns, enabling defined read/write timing behavior.
  • Power Operates from a 2.3 V to 2.7 V supply range as specified for the device.
  • Package Supplied in a 66-TSSOP package (0.400" / 10.16 mm width), suitable for compact board-level mounting.
  • Environmental / Temperature Rated for operation over a commercial temperature range of 0°C to 70°C (TA).

Unique Advantages

  • High-density memory in a small footprint: 512 Mbit capacity (32M × 16) in a 66-TSSOP package conserves PCB area while delivering significant DRAM capacity.
  • DDR performance characteristics: 133 MHz clocking with 750 ps access time and 15 ns write cycle time provides predictable timing for system memory designs.
  • Low-voltage operation: 2.3 V to 2.7 V supply range supports low-voltage system architectures.
  • Parallel interface: Standard parallel DRAM interface and 16-bit organization simplify integration with parallel memory controllers.
  • Commercial temperature rating: Specified for 0°C to 70°C operation for general-purpose electronic applications.

Why Choose MT46V32M16P-75 L:C?

The MT46V32M16P-75 L:C positions itself as a compact, mid-density DDR SDRAM option for designs requiring 512 Mbit of parallel DRAM in a 66-TSSOP package. Its specified timing figures (133 MHz clock, 750 ps access time, 15 ns write cycle) and low-voltage supply range make it suitable for board-level systems where defined DDR performance and a small package are needed.

This device is suited to designers and procurement teams specifying a volatile DDR memory component with clear electrical and thermal operating limits, enabling straightforward evaluation against system-level timing and power budgets.

Request a quote or submit an inquiry to receive pricing and availability information for the MT46V32M16P-75 L:C.

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