MT46V32M16P-75 L:C
| Part Description |
IC DRAM 512MBIT PARALLEL 66TSOP |
|---|---|
| Quantity | 694 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 66-TSOP | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 750 ps | Grade | Commercial | ||
| Clock Frequency | 133 MHz | Voltage | 2.3V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 66-TSSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 4 (72 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of MT46V32M16P-75 L:C – IC DRAM 512MBIT PARALLEL 66TSOP
The MT46V32M16P-75 L:C is a 512 Mbit DDR SDRAM device organized as 32M × 16 with a parallel memory interface. It provides DDR SDRAM architecture with a 133 MHz clock frequency intended for systems that require volatile high-density memory in a compact 66-TSSOP package.
Designed for engineers specifying a 512 Mbit parallel DRAM solution, the device offers defined timing characteristics, a low-voltage supply range, and a commercial operating temperature range for integration into board-level designs.
Key Features
- Core / Memory Architecture DDR SDRAM technology organized as 32M × 16, providing a total memory size of 512 Mbit in a parallel DRAM format.
- Performance 133 MHz clock frequency with an access time of 750 ps and a write cycle time (word page) of 15 ns, enabling defined read/write timing behavior.
- Power Operates from a 2.3 V to 2.7 V supply range as specified for the device.
- Package Supplied in a 66-TSSOP package (0.400" / 10.16 mm width), suitable for compact board-level mounting.
- Environmental / Temperature Rated for operation over a commercial temperature range of 0°C to 70°C (TA).
Unique Advantages
- High-density memory in a small footprint: 512 Mbit capacity (32M × 16) in a 66-TSSOP package conserves PCB area while delivering significant DRAM capacity.
- DDR performance characteristics: 133 MHz clocking with 750 ps access time and 15 ns write cycle time provides predictable timing for system memory designs.
- Low-voltage operation: 2.3 V to 2.7 V supply range supports low-voltage system architectures.
- Parallel interface: Standard parallel DRAM interface and 16-bit organization simplify integration with parallel memory controllers.
- Commercial temperature rating: Specified for 0°C to 70°C operation for general-purpose electronic applications.
Why Choose MT46V32M16P-75 L:C?
The MT46V32M16P-75 L:C positions itself as a compact, mid-density DDR SDRAM option for designs requiring 512 Mbit of parallel DRAM in a 66-TSSOP package. Its specified timing figures (133 MHz clock, 750 ps access time, 15 ns write cycle) and low-voltage supply range make it suitable for board-level systems where defined DDR performance and a small package are needed.
This device is suited to designers and procurement teams specifying a volatile DDR memory component with clear electrical and thermal operating limits, enabling straightforward evaluation against system-level timing and power budgets.
Request a quote or submit an inquiry to receive pricing and availability information for the MT46V32M16P-75 L:C.