MT46V32M16TG-5B:C

IC DRAM 512MBIT PARALLEL 66TSOP
Part Description

IC DRAM 512MBIT PARALLEL 66TSOP

Quantity 42 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOPMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeCommercial
Clock Frequency200 MHzVoltage2.5V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level4 (72 Hours)RoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT46V32M16TG-5B:C – IC DRAM 512MBIT PARALLEL 66TSOP

The MT46V32M16TG-5B:C is a 512 Mbit parallel DRAM device implemented as DDR SDRAM with a 32M × 16 memory organization. It provides a parallel memory interface with a 200 MHz clock specification, operating from a 2.5 V to 2.7 V supply.

This device is suited for system designs that require a 512 Mbit DDR SDRAM element in a compact 66‑TSSOP (0.400", 10.16 mm width) package and an operating ambient range of 0°C to 70°C.

Key Features

  • Memory Core 512 Mbit capacity organized as 32M × 16, implemented as DDR SDRAM for parallel memory applications.
  • Performance 200 MHz clock frequency with a 700 ps access time and a write cycle time (word/page) of 15 ns, providing defined timing for system memory operations.
  • Power Operates from a 2.5 V to 2.7 V supply range, matching systems designed around this voltage window.
  • Package Supplied in a 66‑TSSOP package (0.400" / 10.16 mm width) for space-efficient PCB mounting.
  • Environmental / Operating Range Specified for ambient operation from 0°C to 70°C (TA).
  • Interface Parallel memory interface suitable for designs requiring a parallel DDR connection and timing.

Typical Applications

  • Embedded system memory — Use as a 512 Mbit parallel DDR SDRAM element where a 32M × 16 organization and 200 MHz clocking meet system requirements.
  • Buffer and frame storage — Suitable for buffering or temporary storage functions that rely on defined access time (700 ps) and 15 ns write cycle timing.
  • Prototype and evaluation boards — Provides a standard 66‑TSSOP footprint for evaluation of parallel DDR memory designs in lab and development environments.

Unique Advantages

  • 512 Mbit density in a compact package: Delivers substantial memory capacity in a 66‑TSSOP (10.16 mm width) footprint to save PCB area.
  • Deterministic timing parameters: 700 ps access time and 15 ns write cycle time provide predictable timing for system memory planning.
  • Standard voltage compatibility: 2.5 V–2.7 V supply range aligns with designs using industry-standard DDR voltage rails.
  • Parallel DDR interface: 32M × 16 organization and parallel interface support conventional parallel memory architectures.
  • Specified operating range: Rated for 0°C to 70°C ambient operation to match typical commercial-temperature applications.

Why Choose MT46V32M16TG-5B:C?

The MT46V32M16TG-5B:C positions itself as a straightforward 512 Mbit parallel DDR SDRAM option for designs that require a defined performance profile, including a 200 MHz clock, 700 ps access time, and a 15 ns write cycle. Its 66‑TSSOP package and 2.5 V–2.7 V supply compatibility make it suitable for compact boards and systems aligned to those voltage rails.

This device is ideal for engineers and procurement teams specifying a 32M × 16 DDR memory element with clear timing and thermal limits (0°C to 70°C). Backed by the manufacturer listing, it provides a consistent component choice for designs that require this exact memory organization and package form factor.

Request a quote to inquire about availability and pricing for the MT46V32M16TG-5B:C or to discuss volume and lead-time options.

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