MT46V32M16TG-5B:J

IC DRAM 512MBIT PARALLEL 66TSOP
Part Description

IC DRAM 512MBIT PARALLEL 66TSOP

Quantity 717 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOPMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeCommercial
Clock Frequency200 MHzVoltage2.5V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceN/AREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT46V32M16TG-5B:J – IC DRAM 512Mbit Parallel 66-TSSOP

The MT46V32M16TG-5B:J is a 512 Mbit DDR SDRAM organized as 32M × 16 with a parallel memory interface. It is supplied in a 66-TSSOP package and is manufactured by Micron Technology Inc.

Designed for systems requiring a parallel DDR memory device operating at up to 200 MHz, the device provides defined timing characteristics and operating conditions including a 2.5 V to 2.7 V supply range and a 0°C to 70°C ambient temperature rating.

Key Features

  • Memory Core Volatile DRAM organized as 32M × 16 for a total density of 512 Mbit; technology specified as SDRAM - DDR.
  • Interface Parallel memory interface suitable for parallel DDR implementations.
  • Performance Clock frequency 200 MHz with an access time of 700 ps and a write cycle time (word/page) of 15 ns as specified.
  • Power Operates from 2.5 V to 2.7 V supply voltage.
  • Package 66-TSSOP (0.400", 10.16 mm width) supplier device package for compact PCB footprint.
  • Operating Range Rated for ambient temperatures from 0°C to 70°C (TA).

Unique Advantages

  • Parallel DDR architecture: Provides a straightforward fit for designs requiring a parallel DDR SDRAM device.
  • Mid-range density in a compact package: 512 Mbit capacity with 32M × 16 organization in a 66-TSSOP package supports space-constrained board designs.
  • Defined timing performance: 200 MHz clock frequency, 700 ps access time and 15 ns write cycle time give clear timing targets for system integration.
  • Standard low-voltage operation: 2.5 V–2.7 V supply range aligns with common DDR power domains.
  • Ambient operating specification: Rated for 0°C to 70°C, allowing selection based on the target thermal environment.
  • Manufacturer identification: Offered by Micron Technology Inc., identifying the device source and part numbering.

Why Choose MT46V32M16TG-5B:J?

The MT46V32M16TG-5B:J positions itself as a 512 Mbit parallel DDR SDRAM option that combines defined timing (200 MHz clock, 700 ps access) with a compact 66-TSSOP package and standard DDR voltage range. Its specification set supports integration into designs that require a mid-density, parallel-interface DRAM with clear electrical and thermal parameters.

This part is appropriate for projects that need a Micron-manufactured DDR memory device with the shown organization, timing, package and operating range, providing predictable behavior for system memory design and layout considerations.

Request a quote or submit an inquiry to receive pricing and availability for the MT46V32M16TG-5B:J.

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