MT46V64M8BN-75:D TR

IC DRAM 512MBIT PARALLEL 60FBGA
Part Description

IC DRAM 512MBIT PARALLEL 60FBGA

Quantity 524 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package60-FBGA (10x12.5)Memory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time750 psGradeCommercial
Clock Frequency133 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging60-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level5 (48 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT46V64M8BN-75:D TR – IC DRAM 512MBIT PARALLEL 60FBGA

The MT46V64M8BN-75:D TR is a 512 Mbit DDR SDRAM organized as 64M × 8 with a parallel memory interface. It is offered in a compact 60-TFBGA package and is designed for systems requiring synchronous DRAM with defined timing and supply characteristics.

Key electrical and timing parameters include a 133 MHz clock frequency, 750 ps access time, a 15 ns write cycle time (word/page), and a supply voltage range of 2.3 V to 2.7 V. The device is specified for operation from 0°C to 70°C (TA).

Key Features

  • Memory Architecture 512 Mbit capacity organized as 64M × 8 for parallel DDR access.
  • Memory Type Volatile DRAM using SDRAM - DDR technology with a parallel memory interface.
  • Performance 133 MHz clock frequency, 750 ps access time and 15 ns write cycle time (word/page) provide defined timing for system integration.
  • Power Defined supply voltage range of 2.3 V to 2.7 V to support system power-rail planning.
  • Package 60-TFBGA footprint (60-FBGA, 10 × 12.5 mm) supporting compact board layouts.
  • Operating Conditions Specified for ambient operation from 0°C to 70°C (TA).
  • Mounting & Format Surface-mount, volatile DRAM device in FBGA packaging.

Unique Advantages

  • Deterministic timing: 133 MHz clock and 750 ps access time enable predictable memory latency.
  • Compact footprint: 60-TFBGA (10 × 12.5 mm) package minimizes PCB area for space-constrained designs.
  • Defined power envelope: 2.3 V–2.7 V supply range simplifies integration with common DDR power rails.
  • Standard DDR architecture: Parallel SDRAM - DDR organization (64M × 8) aligns with conventional memory interfaces.
  • Commercial temperature range: Specified 0°C to 70°C operation for typical commercial applications.

Why Choose MT46V64M8BN-75:D TR?

The MT46V64M8BN-75:D TR combines a 512 Mbit DDR SDRAM architecture with defined timing and power specifications to support embedded and system designs that require predictable memory behavior and a compact package. Its combination of 133 MHz clocking, 750 ps access time, and a 60-TFBGA footprint makes it suitable for designs where board space and timing determinism are important.

This device is appropriate for customers seeking a standardized, parallel DDR DRAM component with clear electrical and environmental limits. Its specified voltage range and operating temperature make it straightforward to integrate into commercial-grade systems.

Request a quote or submit a sales inquiry for MT46V64M8BN-75:D TR to obtain current pricing, availability, and ordering information.

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