MT46V64M8BN-75:D TR
| Part Description |
IC DRAM 512MBIT PARALLEL 60FBGA |
|---|---|
| Quantity | 524 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 60-FBGA (10x12.5) | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 750 ps | Grade | Commercial | ||
| Clock Frequency | 133 MHz | Voltage | 2.3V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 60-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 5 (48 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of MT46V64M8BN-75:D TR – IC DRAM 512MBIT PARALLEL 60FBGA
The MT46V64M8BN-75:D TR is a 512 Mbit DDR SDRAM organized as 64M × 8 with a parallel memory interface. It is offered in a compact 60-TFBGA package and is designed for systems requiring synchronous DRAM with defined timing and supply characteristics.
Key electrical and timing parameters include a 133 MHz clock frequency, 750 ps access time, a 15 ns write cycle time (word/page), and a supply voltage range of 2.3 V to 2.7 V. The device is specified for operation from 0°C to 70°C (TA).
Key Features
- Memory Architecture 512 Mbit capacity organized as 64M × 8 for parallel DDR access.
- Memory Type Volatile DRAM using SDRAM - DDR technology with a parallel memory interface.
- Performance 133 MHz clock frequency, 750 ps access time and 15 ns write cycle time (word/page) provide defined timing for system integration.
- Power Defined supply voltage range of 2.3 V to 2.7 V to support system power-rail planning.
- Package 60-TFBGA footprint (60-FBGA, 10 × 12.5 mm) supporting compact board layouts.
- Operating Conditions Specified for ambient operation from 0°C to 70°C (TA).
- Mounting & Format Surface-mount, volatile DRAM device in FBGA packaging.
Unique Advantages
- Deterministic timing: 133 MHz clock and 750 ps access time enable predictable memory latency.
- Compact footprint: 60-TFBGA (10 × 12.5 mm) package minimizes PCB area for space-constrained designs.
- Defined power envelope: 2.3 V–2.7 V supply range simplifies integration with common DDR power rails.
- Standard DDR architecture: Parallel SDRAM - DDR organization (64M × 8) aligns with conventional memory interfaces.
- Commercial temperature range: Specified 0°C to 70°C operation for typical commercial applications.
Why Choose MT46V64M8BN-75:D TR?
The MT46V64M8BN-75:D TR combines a 512 Mbit DDR SDRAM architecture with defined timing and power specifications to support embedded and system designs that require predictable memory behavior and a compact package. Its combination of 133 MHz clocking, 750 ps access time, and a 60-TFBGA footprint makes it suitable for designs where board space and timing determinism are important.
This device is appropriate for customers seeking a standardized, parallel DDR DRAM component with clear electrical and environmental limits. Its specified voltage range and operating temperature make it straightforward to integrate into commercial-grade systems.
Request a quote or submit a sales inquiry for MT46V64M8BN-75:D TR to obtain current pricing, availability, and ordering information.