MT46V64M8BN-6:D TR

IC DRAM 512MBIT PAR 60FBGA
Part Description

IC DRAM 512MBIT PAR 60FBGA

Quantity 50 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package60-FBGA (10x12.5)Memory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeCommercial
Clock Frequency167 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging60-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level5 (48 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT46V64M8BN-6:D TR – IC DRAM 512MBIT PAR 60FBGA

The MT46V64M8BN-6:D TR is a 512 Mbit DDR SDRAM organized as 64M x 8 in a 60-TFBGA package. It provides volatile, parallel DRAM storage with defined performance and electrical characteristics for system integration.

Key device characteristics include a 167 MHz clock frequency, 700 ps access time, and a supply voltage range of 2.3V to 2.7V, making it suitable where a compact, specified DDR memory component is required.

Key Features

  • Memory Type & Format DDR SDRAM; volatile DRAM organized as 64M x 8 for a total capacity of 512 Mbit.
  • Performance Clock frequency of 167 MHz with an access time of 700 ps and a write cycle time (word/page) of 15 ns for defined timing behavior.
  • Interface Parallel memory interface supporting standard parallel DRAM connectivity.
  • Power Operating supply voltage range of 2.3V to 2.7V to match target system rail requirements.
  • Package & Mechanical Supplied in a 60-TFBGA package (supplier device package listed as 60-FBGA (10x12.5)).
  • Operating Conditions Specified operating ambient temperature range of 0°C ~ 70°C (TA).

Unique Advantages

  • Predictable timing performance: 167 MHz clock frequency, 700 ps access time, and 15 ns write cycle time provide clear timing parameters for system design.
  • Compact BGA footprint: 60-TFBGA package (60-FBGA (10x12.5)) enables space-efficient board layouts.
  • Standard parallel DDR interface: Parallel memory interface and 64M x 8 organization simplify integration into parallel DRAM designs.
  • Controlled supply range: 2.3V–2.7V supply voltage range allows compatibility with systems designed to those rail specifications.
  • Defined operating temperature: 0°C–70°C (TA) rating for applications within standard commercial temperature environments.

Why Choose IC DRAM 512MBIT PAR 60FBGA?

The MT46V64M8BN-6:D TR combines DDR SDRAM architecture with clearly specified electrical and timing characteristics—512 Mbit capacity, 64M x 8 organization, 167 MHz clocking, and a 60-TFBGA package—providing a compact, specification-driven memory option for designs that require parallel DRAM. The device is produced by Micron Technology Inc., ensuring component traceability to a known manufacturer.

This part is suitable for designers seeking a defined DDR memory component with documented clock, access, and voltage specifications for predictable integration into commercial-temperature applications.

Request a quote or submit a sourcing inquiry to obtain pricing and availability for the MT46V64M8BN-6:D TR.

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