MT48LC16M16A2P-7E IT:G

The MT48LC16M16A2P-7E IT:G is a 256 Mbit SDRAM organized as 16M × 16 with a parallel memory interface in a 54-pin TSOP II package. It implements fully synchronous SDRAM architecture with internal pipelining and banked memory to support high-throughput system access.

This device targets designs that require standard PC100/PC133-compliant SDRAM behavior, compact 54‑TSOP packaging, and a robust operating range (–40°C to +85°C). Key value comes from its 133 MHz clock rating, programmable burst lengths, and standard 3.3 V supply range for straightforward integration into parallel-memory subsystems.

Key Features

• Memory architecture — 256 Mbit organized as 16M × 16 with 4 internal banks to enable concurrent row access and precharge hiding.
• SDR SDRAM, PC100/PC133-compliant — Fully synchronous operation with all signals registered on the positive edge of the system clock; specified for 133 MHz operation.
• Timing and latency — Speed grade -7E targets 133 MHz with shortened RCD/RP/CL timing (2-2-2); access time specified as 5.4 ns and write cycle time (word/page) of 14 ns.
• Burst and refresh modes — Programmable burst lengths (1, 2, 4, 8, full page), auto precharge, auto refresh and self-refresh modes (self-refresh not available on AT devices); 8K refresh cycles per refresh interval as specified.
• Interface and I/O — Parallel memory interface with LVTTL-compatible inputs and outputs for standard logic-level interoperability.
• Power — Single 3.3 V supply (3.0 V to 3.6 V) as specified for standard SDRAM operation.
• Package and mounting — 54-pin TSOP II (0.400", 10.16 mm width) plastic package for compact board-level integration.
• Operating range — Specified ambient operating temperature: –40°C to +85°C (TA).

Typical Applications

• PC100/PC133 memory subsystems — Use as standard SDRAM in systems designed to PC100/PC133 timing requirements.
• Embedded parallel memory — Parallel SDRAM for embedded designs requiring a compact 54‑TSOP package and standard 3.3 V operation.
• Industrial equipment — Suitable for industrial-temperature designs operating across –40°C to +85°C where SDRAM burst and refresh features are needed.

Unique Advantages

• Standards-based timing: PC100/PC133 compliance and a 133 MHz clock rating provide predictable integration into systems targeting those speeds.
• Low-latency operation: -7E speed grade with 2-2-2 RCD/RP/CL timing supports reduced CAS latency for faster read access.
• Flexible data transfer: Programmable burst lengths and internal pipelining allow designers to match transfer behavior to system needs.
• Robust thermal range: Specified operation from –40°C to +85°C supports harsher ambient environments.
• Compact board footprint: 54‑pin TSOP II package provides a space-efficient form factor for high-density board designs.
• Standard power requirements: Single 3.3 V supply (3.0–3.6 V) simplifies power rail design in existing SDRAM-based systems.

Why Choose MT48LC16M16A2P-7E IT:G?

The MT48LC16M16A2P-7E IT:G combines standard SDRAM features—synchronous operation, internal banks, programmable bursts, and auto-refresh—with a 16M × 16 organization and 54‑TSOP II packaging for compact parallel-memory integration. Its 133 MHz rating and -7E timing profile deliver reduced CAS latency while maintaining compatibility with PC100/PC133 system requirements.

This device is appropriate for engineers specifying a proven SDRAM component for parallel-memory subsystems in embedded and industrial applications that require a 3.3 V supply and an extended operating temperature range. The standard SDRAM feature set simplifies integration and design reuse where programmable bursts and refresh behaviors are required.

Request a quote or submit an inquiry to obtain pricing and availability for the MT48LC16M16A2P-7E IT:G and to discuss lead times and volume options.