MT48LC2M32B2P-6A AAT:J
| Part Description |
IC DRAM 64MBIT PAR 86TSOP II |
|---|---|
| Quantity | 1,328 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 86-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 5.4 ns | Grade | Automotive | ||
| Clock Frequency | 167 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | 12 ns | Packaging | 86-TFSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 2M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | AEC-Q100 | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of MT48LC2M32B2P-6A AAT:J – IC DRAM 64MBIT PAR 86TSOP II
The MT48LC2M32B2P-6A AAT:J is a 64 Mbit SDR SDRAM organized as 2M × 32 with a parallel memory interface. It implements a fully synchronous, pipelined SDRAM architecture with internal bank management and programmable burst lengths to support high-throughput read/write operations.
With a 3.3 V single-supply range (3.0 V to 3.6 V), a clock frequency option of 167 MHz, and an operating temperature range of −40°C to 105°C, this device is specified for automotive-grade environments and designs that require a robust, parallel SDRAM memory solution in an 86-pin TSOP II package.
Key Features
- Core / Memory Architecture 64 Mbit SDR SDRAM organized as 2M × 32 with 4 internal banks (512K × 32 × 4 banks) for hidden row access and precharge.
- Synchronous, Pipelined Operation Fully synchronous device with all signals registered on the positive edge of the system clock and internal pipelined operation to allow column address changes every clock cycle.
- Performance Clock frequency option of 167 MHz (–6A speed grade) with typical access characteristics including a 5.4 ns access time and support for CAS latency (CL) 1, 2, and 3.
- Flexible Burst and Timing Programmable burst lengths (1, 2, 4, 8, or full page), auto precharge, auto refresh, and support for auto and self-refresh modes (self-refresh availability depends on device option).
- Interface and Levels Parallel memory interface with LVTTL-compatible inputs and outputs; supports standard SDRAM command set including READ, WRITE, PRECHARGE, and REFRESH.
- Power Single-supply operation at 3.3 V ±0.3 V (specified 3.0 V to 3.6 V) for straightforward integration into 3.3 V systems.
- Package and Mounting 86-pin TSOP II (400 mil, 10.16 mm width) package for surface-mount assembly and board-level memory implementations.
- Temperature and Qualification Automotive-grade operating temperature of −40°C to 105°C (TA) and AEC-Q100 qualification for applications requiring automotive-level reliability.
Typical Applications
- Automotive systems On-board parallel SDRAM for automotive modules where AEC-Q100 qualification and −40°C to 105°C operation are required.
- Parallel memory subsystems System memory for designs requiring a 64 Mbit parallel SDRAM in an 86-pin TSOP II package.
- Industrial equipment Memory for controllers and modules operating across wide temperature ranges and using a 3.3 V supply.
Unique Advantages
- Automotive-qualified reliability: AEC-Q100 qualification and an automotive operating temperature range provide specification-level suitability for automotive deployment.
- Standard 86‑pin TSOP II package: Enables drop-in implementation into designs using 86-pin TSOP II form factor for straightforward PCB layout and assembly.
- Synchronous pipelined architecture: Internal pipelining and multiple banks help maintain throughput by allowing column address changes every clock cycle.
- Flexible timing and burst options: Programmable burst lengths and support for multiple CAS latencies let designers tune performance and latency to system needs.
- Single 3.3 V supply: Operation across 3.0 V to 3.6 V simplifies power-supply design in 3.3 V systems.
- Wide operating temperature: Specified −40°C to 105°C (TA) supports operation in thermally demanding environments.
Why Choose IC DRAM 64MBIT PAR 86TSOP II?
The MT48LC2M32B2P-6A AAT:J provides a compact, automotive-grade SDRAM option for designs needing 64 Mbit of parallel memory with predictable synchronous performance. Its combination of a pipelined SDR architecture, programmable burst modes, and support for multiple CAS latencies makes it suitable for systems that require configurable throughput and latency in a standard 86-pin TSOP II package.
This device is appropriate for customers implementing parallel SDRAM memory subsystems in automotive and industrial contexts, offering long-term specification clarity through AEC-Q100 qualification, a specified wide temperature range, and a common 3.3 V single-supply interface.
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