MT48LC2M32B2P-7 IT:G

The MT48LC2M32B2P-7 IT:G is a 64 Mbit (2M × 32) synchronous DRAM (SDR SDRAM) device in an 86‑pin TSOP II package. It implements a fully synchronous, pipelined architecture with internal banks and a parallel memory interface for system memory subsystems.

Designed for systems requiring PC100‑compliant SDRAM performance, the device operates from a single 3.0 V to 3.6 V supply, supports burst transfers and programmable CAS latency, and is offered with an industrial operating temperature range of –40°C to +85°C.

Key Features

• Core / Architecture 512K × 32 × 4 banks organization (2M × 32) with internal bank structure to hide row access and precharge latencies.
• SDR SDRAM Functionality Fully synchronous operation with all signals registered on the positive edge of the system clock and internal pipelined operation for per‑cycle column address changes.
• Performance 143 MHz clock frequency (–7 speed grade) and a 5.5 ns access time; supports CAS latencies (CL) of 1, 2 and 3 to match system timing needs.
• Burst and Transfer Modes Programmable burst lengths (1, 2, 4, 8, or full page) and auto precharge/auto refresh options to streamline burst transfers and refresh management.
• Refresh and Reliability Supports auto refresh and a 64 ms / 4096‑cycle refresh scheme (commercial/industrial options documented) to maintain data integrity in volatile memory.
• Voltage and I/O Single 3.0 V to 3.6 V supply with LVTTL‑compatible inputs and outputs for standard 3.3 V system integration.
• Package 86‑pin TSOP II (0.400", 10.16 mm width) package (86‑TFSOP / 86‑TSOP II) for compact board integration.
• Operating Range Industrial temperature range: –40°C to +85°C (TA), suitable for temperature‑sensitive deployments within that range.

Typical Applications

• PC and legacy memory systems PC100‑compliant SDRAM device suitable for systems and modules that require standard SDR SDRAM timing and interface.
• Embedded memory subsystems Parallel SDRAM for embedded designs needing a compact 86‑pin TSOP II package and standard 3.3 V signaling.
• Industrial control and instrumentation Industrial temperature range (–40°C to +85°C) supports applications where extended ambient operation is required.

Unique Advantages

• PC100 compliance: Documented PC100‑compliant SDR SDRAM timing and operation for compatibility with PC‑class memory requirements.
• Flexible timing options: Support for CAS latencies 1–3 and programmable burst lengths enables tuning for performance versus latency tradeoffs.
• Compact package footprint: 86‑pin TSOP II (400 mil) package delivers high‑density 64 Mbit memory in a board‑friendly form factor.
• Single‑supply integration: Operates on a single 3.0 V–3.6 V supply (3.3 V ±0.3 V), simplifying power rail requirements.
• On‑chip refresh and power modes: Auto refresh and self‑refresh capabilities (per datasheet) reduce external control complexity for volatile memory retention during idle periods.
• Manufacturer documentation: Detailed datasheet content describes electrical, timing and functional behavior to support system integration and validation.

Why Choose MT48LC2M32B2P-7 IT:G?

The MT48LC2M32B2P-7 IT:G provides a documented, PC100‑compliant SDRAM option in a compact 86‑pin TSOP II package tailored for parallel memory subsystems. With support for multiple CAS latencies, programmable burst lengths and on‑chip refresh modes, it offers designers deterministic timing control and flexible transfer modes for system memory implementations.

Manufactured by Micron Technology, Inc., the device is supplied with comprehensive datasheet specifications covering timing, electrical characteristics and package dimensions to aid integration into embedded, PC and industrial systems within the specified voltage and temperature ranges.

Request a quote or submit a request for pricing and availability for the MT48LC2M32B2P-7 IT:G to receive detailed commercial information and lead‑time options.