MT48LC2M32B2P-7 IT:G TR

The MT48LC2M32B2P-7 IT:G TR is a 64 Mbit SDR SDRAM organized as 2M × 32 with a parallel memory interface, supplied in an 86‑pin TSOP II (400 mil) package. It implements a fully synchronous SDRAM architecture with internal banks and programmable burst operation.

This device targets designs that require a compact, parallel SDRAM solution with industrial temperature capability and standard TSOP II packaging for surface-mount mounting and board-level memory subsystems.

Key Features

• Core / Architecture  Fully synchronous SDR SDRAM with internal pipelined operation and multiple internal banks for improved row access and precharge handling.
• Memory Organization  64 Mbit capacity organized as 2M × 32 (512K × 32 × 4 banks), providing a wide 32‑bit data path for parallel systems.
• Timing and Performance  Clock frequency specified at 143 MHz for the -7 speed grade and an access time of 5.5 ns; supports CAS latency (CL) settings of 1, 2 and 3 and programmable burst lengths of 1, 2, 4, 8 or full page.
• Refresh and Power  Supports auto refresh and self refresh (self refresh not available on AT devices); single 3.3 V ±0.3 V power supply range (3.0 V–3.6 V).
• Interface and Compatibility  Parallel memory interface with LVTTL‑compatible inputs/outputs and support for PC100 timing compliance as indicated in the datasheet options.
• Package and Mounting  86‑pin TSOP II (0.400", 10.16 mm width) plastic package (surface‑mount), supplier device package listed as 86‑TSOP II.
• Operating Range  Specified operating ambient temperature range of −40 °C to +85 °C (TA) for industrial operation.

Typical Applications

• PC100‑class memory subsystems  Use in systems targeting PC100 timing and synchronous DRAM operation where a 32‑bit parallel SDRAM device is required.
• Embedded parallel memory boards  Fits board‑level designs needing a 64 Mbit parallel SDRAM in an industry‑standard TSOP II footprint.
• Industrial electronics  Suitable for industrial applications that require operation across −40 °C to +85 °C ambient temperature.

Unique Advantages

• 32‑bit parallel organization: Provides a wide data bus (2M × 32) for straightforward integration into parallel memory systems.
• Flexible timing and burst modes: Programmable burst lengths and CL = 1, 2, 3 support allow tuning for system throughput and latency requirements.
• Industry‑standard packaging: 86‑pin TSOP II (400 mil) simplifies replacement and board‑level routing in existing TSOP footprints.
• Industrial temperature performance: Rated for −40 °C to +85 °C (TA), enabling use in temperature‑sensitive embedded and industrial equipment.
• Simple power requirements: Single 3.3 V ±0.3 V supply window (3.0 V–3.6 V) eases power‑rail design and compatibility with common system voltages.

Why Choose MT48LC2M32B2P-7 IT:G TR?

The MT48LC2M32B2P-7 IT:G TR delivers a compact, parallel SDRAM solution with a 64 Mbit capacity, 2M × 32 organization and industry-standard 86‑TSOP II packaging. Its synchronous architecture, internal banking and configurable burst and CAS settings provide predictable timing options for parallel memory subsystems.

With industrial temperature support and a single 3.3 V supply range, this Micron SDRAM part is suited to designs that require a proven, surface‑mount parallel memory device in a standard footprint, while enabling designers to tune latency and burst behavior to match system requirements.

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