MT48LC8M16A2B4-75 IT:G TR

The MT48LC8M16A2B4-75 IT:G TR is a 128 Mbit SDR SDRAM device organized as 8M × 16 with a parallel memory interface in a 54-ball VFBGA (8 mm × 8 mm) package. It implements fully synchronous SDRAM architecture with internal pipelined operation and is PC100/PC133-compliant for systems operating at 133 MHz.

This device is intended for designs requiring synchronous DRAM storage with features such as programmable burst lengths, internal banked memory for row access/precharge hiding, and support for auto refresh and self-refresh modes. It supports a 3.0 V to 3.6 V supply and an operating temperature range of –40 °C to +85 °C.

Key Features

• Core Architecture  128 Mbit SDR SDRAM organized as 8M × 16 with 4 internal banks; fully synchronous operation with all signals registered on the positive edge of the system clock.
• Performance / Timing  PC100- and PC133-compliant operation at a 133 MHz clock; this -75 speed grade targets 3-3-3 timing (RCD-RP-CL). Write cycle time (word/page) is specified at 15 ns.
• Burst and Pipelining  Internal pipelined operation with programmable burst lengths (BL = 1, 2, 4, 8, or full page) and the ability to change column address every clock cycle.
• Refresh and Power Modes  Supports auto refresh and self-refresh modes (standard and low power options noted in the datasheet) and provides 4096-cycle refresh support as specified for commercial and industrial operation.
• Interface and I/O  Parallel memory interface with LVTTL-compatible inputs and outputs as documented in the datasheet.
• Power  Single-supply operation: 3.0 V to 3.6 V (3.3 V ±0.3 V referenced in datasheet content).
• Package  54-ball VFBGA package (8 mm × 8 mm) in a 54-VFBGA (8×8) supplier device package for compact board-level integration.
• Temperature Range  Industrial ambient operating range: –40 °C to +85 °C (TA).

Unique Advantages

• PC133-Compliant Timing: Enables synchronous operation at 133 MHz with documented 3-3-3 timing for the -75 speed grade, supporting legacy PC100/PC133 system designs.
• Flexible Burst and Pipelined Access: Programmable burst lengths and internal pipelining permit fine-grained control of column accesses and data throughput per clock cycle.
• Compact BGA Footprint: 54-ball VFBGA (8×8 mm) package reduces PCB area for space-constrained applications while providing a robust solderable package.
• Industrial Temperature Capability: Rated for −40 °C to +85 °C, suitable for designs that require extended ambient temperature operation.
• Single-Supply Operation: Operates from 3.0 V to 3.6 V, aligning with common 3.3 V system power rails for straightforward integration.
• Refresh and Self-Refresh Support: Implements auto refresh and self-refresh modes with 4096-cycle refresh behavior documented for use across commercial and industrial ranges.

Why Choose IC DRAM 128MBIT PAR 54VFBGA?

The MT48LC8M16A2B4-75 IT:G TR is positioned for designs that require synchronous, parallel DRAM storage in a compact BGA package with industrial temperature capability. Its PC133-compliant operation, programmable burst lengths, and internal bank architecture provide predictable timing and flexible data access patterns for systems that rely on SDRAM.

This device is suited to projects needing a compact 128 Mbit SDRAM solution with documented timing grades and standard refresh/power modes, delivering long-term integration options where compatibility with 3.3 V system rails and extended temperature operation are important.

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