MT48LC8M16A2P-7E IT:G

IC DRAM 128MBIT PAR 54TSOP II
Part Description

IC DRAM 128MBIT PAR 54TSOP II

Quantity 1,700 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency133 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page14 nsPackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 16
Moisture Sensitivity Level2 (1 Year)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of MT48LC8M16A2P-7E IT:G – IC DRAM 128MBIT PAR 54TSOP II

The MT48LC8M16A2P-7E IT:G is a 128 Mbit SDRAM organized as 8M × 16 with a parallel memory interface in a 54-pin TSOP II package. It is a fully synchronous SDR SDRAM device with internal pipelined operation and internal banks to improve access sequencing.

Designed for systems requiring PC100/PC133-class SDRAM operation and extended operating temperature support, this device delivers 133 MHz clock operation, a single 3.0–3.6 V supply, and an industrial temperature range of −40 °C to +85 °C.

Key Features

  • Core / Architecture  Fully synchronous SDR SDRAM with internal pipelined operation; all signals are registered on the positive edge of the system clock.
  • Memory Organization  128 Mbit capacity arranged as 8M × 16 with four internal banks to hide row access and precharge timing.
  • Performance  133 MHz clock frequency; documented access time 5.4 ns and write cycle time (word page) of 14 ns. Speed grade -7E timing options are supported per the device family.
  • Burst and Command Flexibility  Programmable burst lengths (1, 2, 4, 8, or full page) and support for auto precharge and auto refresh modes to simplify memory sequencing.
  • Refresh and Self-Refresh  Auto refresh support with 4096-cycle refresh; standard and low-power self-refresh modes are provided (low-power self-refresh not available on AT devices as noted in device options).
  • Power  Single-supply operation at 3.0 V to 3.6 V (3.3 V nominal).
  • Interface  Parallel memory interface with LVTTL-compatible inputs and outputs as specified in the device family documentation.
  • Package & Temperature  54-pin TSOP II (0.400", 10.16 mm width) package; industrial operating temperature range −40 °C to +85 °C (TA).

Typical Applications

  • PC100/PC133-class systems  Use as system DRAM in designs targeting PC100 or PC133 compliant memory architectures.
  • Industrial equipment  Suitable for industrial applications that require extended temperature operation (−40 °C to +85 °C) and parallel SDRAM memory.
  • Embedded parallel-memory platforms  Integration where a parallel SDRAM with programmable burst lengths and internal banking is required for buffering or working memory.

Unique Advantages

  • Industry-standard SDRAM timing:  PC100/PC133-compliant speed grades and documented timing options (including -7E) make system timing integration straightforward.
  • High-frequency operation:  133 MHz clock capability supports higher throughput for parallel SDRAM designs.
  • Flexible burst and bank management:  Programmable burst lengths and four internal banks enable efficient data streaming and reduced latency between column accesses.
  • Extended temperature range:  Industrial −40 °C to +85 °C rating supports deployment in temperature-demanding environments.
  • Standard TSOP II footprint:  54-pin TSOP II (0.400", 10.16 mm) package for board-level compatibility with legacy and space-constrained designs.
  • Single-supply operation:  3.0–3.6 V supply simplifies power rail requirements for 3.3 V systems.

Why Choose IC DRAM 128MBIT PAR 54TSOP II?

The MT48LC8M16A2P-7E IT:G offers a compact 128 Mbit SDRAM solution with PC100/PC133-class timing, programmable burst modes, and internal banking to support efficient memory access patterns. Its 54-pin TSOP II package and single 3.0–3.6 V supply make it suitable for designs that require a parallel SDRAM footprint with industrial temperature capability.

This device is appropriate for engineers specifying parallel SDRAM for system memory, embedded platforms, or industrial applications where documented timing, self-refresh options, and extended temperature range are required for long-term system reliability.

Request a quote or submit an inquiry to receive pricing and availability information for the MT48LC8M16A2P-7E IT:G.

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