MT48LC8M16A2P-7E IT:G
| Part Description |
IC DRAM 128MBIT PAR 54TSOP II |
|---|---|
| Quantity | 1,700 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 133 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 14 ns | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 8M x 16 | ||
| Moisture Sensitivity Level | 2 (1 Year) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of MT48LC8M16A2P-7E IT:G – IC DRAM 128MBIT PAR 54TSOP II
The MT48LC8M16A2P-7E IT:G is a 128 Mbit SDRAM organized as 8M × 16 with a parallel memory interface in a 54-pin TSOP II package. It is a fully synchronous SDR SDRAM device with internal pipelined operation and internal banks to improve access sequencing.
Designed for systems requiring PC100/PC133-class SDRAM operation and extended operating temperature support, this device delivers 133 MHz clock operation, a single 3.0–3.6 V supply, and an industrial temperature range of −40 °C to +85 °C.
Key Features
- Core / Architecture Fully synchronous SDR SDRAM with internal pipelined operation; all signals are registered on the positive edge of the system clock.
- Memory Organization 128 Mbit capacity arranged as 8M × 16 with four internal banks to hide row access and precharge timing.
- Performance 133 MHz clock frequency; documented access time 5.4 ns and write cycle time (word page) of 14 ns. Speed grade -7E timing options are supported per the device family.
- Burst and Command Flexibility Programmable burst lengths (1, 2, 4, 8, or full page) and support for auto precharge and auto refresh modes to simplify memory sequencing.
- Refresh and Self-Refresh Auto refresh support with 4096-cycle refresh; standard and low-power self-refresh modes are provided (low-power self-refresh not available on AT devices as noted in device options).
- Power Single-supply operation at 3.0 V to 3.6 V (3.3 V nominal).
- Interface Parallel memory interface with LVTTL-compatible inputs and outputs as specified in the device family documentation.
- Package & Temperature 54-pin TSOP II (0.400", 10.16 mm width) package; industrial operating temperature range −40 °C to +85 °C (TA).
Typical Applications
- PC100/PC133-class systems Use as system DRAM in designs targeting PC100 or PC133 compliant memory architectures.
- Industrial equipment Suitable for industrial applications that require extended temperature operation (−40 °C to +85 °C) and parallel SDRAM memory.
- Embedded parallel-memory platforms Integration where a parallel SDRAM with programmable burst lengths and internal banking is required for buffering or working memory.
Unique Advantages
- Industry-standard SDRAM timing: PC100/PC133-compliant speed grades and documented timing options (including -7E) make system timing integration straightforward.
- High-frequency operation: 133 MHz clock capability supports higher throughput for parallel SDRAM designs.
- Flexible burst and bank management: Programmable burst lengths and four internal banks enable efficient data streaming and reduced latency between column accesses.
- Extended temperature range: Industrial −40 °C to +85 °C rating supports deployment in temperature-demanding environments.
- Standard TSOP II footprint: 54-pin TSOP II (0.400", 10.16 mm) package for board-level compatibility with legacy and space-constrained designs.
- Single-supply operation: 3.0–3.6 V supply simplifies power rail requirements for 3.3 V systems.
Why Choose IC DRAM 128MBIT PAR 54TSOP II?
The MT48LC8M16A2P-7E IT:G offers a compact 128 Mbit SDRAM solution with PC100/PC133-class timing, programmable burst modes, and internal banking to support efficient memory access patterns. Its 54-pin TSOP II package and single 3.0–3.6 V supply make it suitable for designs that require a parallel SDRAM footprint with industrial temperature capability.
This device is appropriate for engineers specifying parallel SDRAM for system memory, embedded platforms, or industrial applications where documented timing, self-refresh options, and extended temperature range are required for long-term system reliability.
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