MT53D1G32D4BD-053 WT:D
| Part Description |
IC DRAM 32GBIT 1.866GHZ FBGA QDP |
|---|---|
| Quantity | 309 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | N/A | Memory Format | DRAM | Technology | SDRAM - Mobile LPDDR4 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 1.866 GHz | Voltage | 1.1V | Memory Type | Volatile | ||
| Operating Temperature | -30°C ~ 85°C (TC) | Write Cycle Time Word Page | N/A | Packaging | N/A | ||
| Mounting Method | Volatile | Memory Interface | N/A | Memory Organization | 1G x 32 | ||
| Moisture Sensitivity Level | 1 (Unlimited) | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | OBSOLETE | HTS Code | N/A |
Overview of MT53D1G32D4BD-053 WT:D – IC DRAM 32GBIT 1.866GHZ FBGA QDP
The MT53D1G32D4BD-053 WT:D is a 32 Gbit volatile DRAM device implemented in SDRAM - Mobile LPDDR4 architecture by Micron Technology Inc. It is organized as 1G x 32 and specified for a clock frequency of 1.866 GHz with a 1.1 V supply.
This component targets designs that require high-density LPDDR4 memory in an FBGA QDP package and operation across a temperature range of -30°C ~ 85°C (TC).
Key Features
- Memory Technology SDRAM - Mobile LPDDR4 architecture as specified in the product data.
- Capacity & Organization 32 Gbit total capacity, organized as 1G × 32.
- Clock Frequency Specified operating clock frequency of 1.866 GHz.
- Supply Voltage Operates from a 1.1 V supply voltage.
- Package Described as an FBGA QDP package in the product name.
- Operating Temperature Specified temperature range of -30°C ~ 85°C (TC).
- Memory Type Volatile DRAM format intended for LPDDR4 applications.
Typical Applications
- Mobile LPDDR4 memory subsystems — Component can be used where LPDDR4 SDRAM at 1.866 GHz and 32 Gbit density is required.
- High-density memory modules — Suitable for designs needing a 1G × 32 DRAM device to achieve 32 Gbit capacity.
- Thermally constrained environments — Usable in systems operating across the specified -30°C ~ 85°C (TC) range.
Unique Advantages
- High memory density: 32 Gbit capacity enables compact designs requiring large DRAM storage.
- LPDDR4 architecture: Explicit Mobile LPDDR4 technology and 1.866 GHz clock frequency provide a defined performance point for qualifying system memory interfaces.
- Low-voltage operation: 1.1 V supply supports designs targeting lower supply voltage domains.
- Clear temperature specification: Rated for -30°C ~ 85°C (TC), allowing planning for target operating environments.
- Standard memory organization: 1G × 32 organization simplifies memory planning and addressing for system architects.
Why Choose IC DRAM 32GBIT 1.866GHZ FBGA QDP?
The MT53D1G32D4BD-053 WT:D delivers a defined LPDDR4 memory option with 32 Gbit density, 1G × 32 organization and a 1.866 GHz clock specification sourced from Micron Technology Inc. Its 1.1 V supply requirement and specified operating temperature range support designs targeting mobile LPDDR4 memory implementations and similar applications.
This device is appropriate for engineers and procurement teams seeking a high-density LPDDR4 DRAM component with explicit electrical and thermal parameters to match system requirements and integration constraints.
Request a quote or submit an inquiry to receive pricing and availability information for the MT53D1G32D4BD-053 WT:D.
