MT53D1G32D4BD-053 WT ES:D

IC DRAM 32GBIT 1.866GHZ FBGA QDP
Part Description

IC DRAM 32GBIT 1.866GHZ FBGA QDP

Quantity 445 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageN/AMemory FormatDRAMTechnologySDRAM - Mobile LPDDR4
Memory Size32 GbitAccess TimeN/AGradeIndustrial
Clock Frequency1.866 GHzVoltage1.1VMemory TypeVolatile
Operating Temperature-30°C ~ 85°C (TC)Write Cycle Time Word PageN/APackagingN/A
Mounting MethodVolatileMemory InterfaceN/AMemory Organization1G x 32
Moisture Sensitivity Level1 (Unlimited)RoHS ComplianceUnknownREACH ComplianceREACH Unknown
QualificationN/AECCNOBSOLETEHTS CodeN/A

Overview of MT53D1G32D4BD-053 WT ES:D – IC DRAM 32GBIT 1.866GHZ FBGA QDP

The MT53D1G32D4BD-053 WT ES:D is a volatile DRAM device built on Mobile LPDDR4 SDRAM technology. It provides 32 Gbit of memory organized as 1G × 32 and is specified for operation at a clock frequency of 1.866 GHz.

This device operates from a 1.1 V supply and is offered in a FBGA QDP package variant, with an operating temperature range of −30°C to 85°C (TC).

Key Features

  • Memory Core  Mobile LPDDR4 SDRAM architecture; volatile DRAM with a total capacity of 32 Gbit.
  • Organization  Arranged as 1G × 32, providing a wide data path for system memory integration.
  • Performance  Specified clock frequency of 1.866 GHz for high-rate memory operation.
  • Power  Operates from a 1.1 V supply voltage for low-voltage memory operation.
  • Package  Delivered in an FBGA QDP package variant as indicated in the product designation.
  • Temperature Range  Rated for operation from −30°C to 85°C (TC).

Unique Advantages

  • High-density 32 Gbit capacity: Provides substantial memory capacity within a single device for compact implementations requiring large memory footprints.
  • High data-rate operation: 1.866 GHz clock frequency supports high-throughput memory transactions where specified by system design.
  • Low-voltage operation: 1.1 V supply supports lower-voltage system designs and can contribute to reduced power budget when used per system requirements.
  • Wide data organization: 1G × 32 organization offers a broad data path for integration into systems expecting 32-bit memory lanes.
  • Extended operating temperature: −30°C to 85°C rating supports deployment in environments within that thermal range.

Why Choose MT53D1G32D4BD-053 WT ES:D?

The MT53D1G32D4BD-053 WT ES:D combines Mobile LPDDR4 architecture, high-density 32 Gbit capacity, and a 1.866 GHz operating frequency to deliver a specification-driven memory option for designs that require these exact characteristics. Its 1G × 32 organization and 1.1 V supply voltage align with systems designed around LPDDR4 memory interfaces and low-voltage operation.

This device is appropriate for projects and designs that explicitly require a 32 Gbit LPDDR4 device with the listed clock, voltage, and temperature specifications. Its defined electrical and thermal parameters provide clear, verifiable attributes for system integration and long-term product planning.

If you would like pricing or availability information, request a quote or submit a product inquiry to our sales team quoting MT53D1G32D4BD-053 WT ES:D.

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