MT53E1G64D4SQ-046 WT:A

IC DRAM 64GBIT 2.133GHZ WFBGA
Part Description

IC DRAM 64GBIT 2.133GHZ WFBGA

Quantity 32 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageN/AMemory FormatDRAMTechnologySDRAM - Mobile LPDDR4
Memory Size64 GbitAccess TimeN/AGradeIndustrial
Clock Frequency2.133 GHzVoltage1.1VMemory TypeVolatile
Operating Temperature-30°C ~ 85°C (TC)Write Cycle Time Word PageN/APackagingN/A
Mounting MethodVolatileMemory InterfaceN/AMemory Organization1G x 64
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCNOBSOLETEHTS Code0000.00.0000

Overview of MT53E1G64D4SQ-046 WT:A – IC DRAM 64GBIT 2.133GHZ WFBGA

The MT53E1G64D4SQ-046 WT:A is a 64 Gbit volatile memory device implemented as mobile LPDDR4 SDRAM. It provides a 1G × 64 memory organization and operates at a clock frequency of 2.133 GHz with a 1.1 V supply.

This device is targeted at designs that require high-density mobile LPDDR4 memory and operation across a broad temperature range, offering a combination of density, frequency, and low-voltage operation.

Key Features

  • Memory Architecture 1G × 64 organization delivering a total memory capacity of 64 Gbit suitable for high-density memory requirements.
  • Technology Mobile LPDDR4 SDRAM technology providing standard LPDDR4 behavior for compatible system designs.
  • Clock / Performance Rated clock frequency of 2.133 GHz to support high-rate data transfer in supported memory subsystems.
  • Power Low-voltage operation at 1.1 V to align with LPDDR4 power domains.
  • Operating Temperature Specified operating temperature range of −30°C to 85°C (TC) for use in varied thermal environments.
  • Memory Type Volatile DRAM format intended for transient data storage in system memory stacks.
  • Package WFBGA package designation indicated in the product name for board-level integration.

Typical Applications

  • Mobile devices — LPDDR4 technology and the 1.1 V supply make this device suitable for use in mobile memory subsystems where LPDDR4 is specified.
  • Embedded systems — High density (64 Gbit) memory configurations for embedded platforms that require large volatile storage.
  • Memory-dense SoC support — Acts as onboard DRAM for system-on-chip designs that require a 1G × 64 LPDDR4 interface and 2.133 GHz operation.

Unique Advantages

  • High density 64 Gbit capacity: Reduces the number of memory components needed to reach large volatile storage totals.
  • LPDDR4 mobile technology: Aligns with mobile LPDDR4 design requirements for systems using that memory standard.
  • 2.133 GHz clock rating: Supports higher-frequency operation for memory subsystems designed to leverage increased throughput.
  • Low 1.1 V supply: Enables compatibility with low-voltage memory power domains to help manage system power budgets.
  • Wide operating temperature range: Specified −30°C to 85°C (TC) for deployment across a range of thermal conditions.

Why Choose IC DRAM 64GBIT 2.133GHZ WFBGA?

The MT53E1G64D4SQ-046 WT:A positions itself as a high-density LPDDR4 SDRAM option from Micron Technology Inc., combining 64 Gbit capacity with a 1G × 64 organization and a 2.133 GHz clock rating. Its 1.1 V supply and specified temperature range address low-voltage and broad-environment design considerations.

This device is appropriate for designers and procurement teams specifying mobile LPDDR4 memory where large volatile capacity, defined clocking at 2.133 GHz, and a WFBGA package designation are required. Its specification set supports integration into systems that require these explicit LPDDR4 characteristics.

To request a quote or discuss pricing and availability for the MT53E1G64D4SQ-046 WT:A, please contact sales or submit a request for quotation through your preferred procurement channel.

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