NAND512W3A2SZAXE

IC FLASH 512MBIT PAR 63VFBGA
Part Description

IC FLASH 512MBIT PAR 63VFBGA

Quantity 863 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package63-VFBGA (9x11)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size512 MbitAccess Time50 nsGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page50 nsPackaging63-TFBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of NAND512W3A2SZAXE – 512 Mbit NAND Flash, Parallel, 63-VFBGA

The NAND512W3A2SZAXE is a 512 Mbit non-volatile NAND flash memory device organized as 64M x 8. It implements parallel NAND flash architecture in a compact 63-VFBGA (9x11) package for board-level mounting.

Designed for systems that require on-board non-volatile storage, this device offers a 50 ns access time, a 2.7 V to 3.6 V supply range, and an operating temperature range of -40°C to 85°C, delivering deterministic electrical and thermal operating parameters for system designers.

Key Features

  • Memory Type & Organization Non-volatile NAND flash memory organized as 64M × 8, providing 512 Mbit of storage capacity.
  • Interface Parallel NAND memory interface for direct integration with parallel memory controllers and legacy parallel buses.
  • Performance 50 ns access time with a write cycle time (word/page) of 50 ns, enabling predictable read/write timings.
  • Power Operates from a 2.7 V to 3.6 V supply range to match standard 3.3 V system rails.
  • Package & Mounting 63-VFBGA (9×11) package in a 63-ball TFBGA form factor suitable for surface-mount assembly.
  • Operating Conditions Rated for an ambient operating temperature range of -40°C to 85°C (TA).

Unique Advantages

  • Substantial non-volatile capacity: 512 Mbit storage provides ample space for firmware, data logging, or asset storage within constrained system footprints.
  • Deterministic timing: 50 ns access and write cycle times allow predictable memory timing for system-level integration and control.
  • Standard voltage range: 2.7 V to 3.6 V compatibility simplifies power-supply design in 3.3 V-based systems.
  • Compact BGA package: 63-VFBGA (9×11) offers a small board area for high-density implementations while supporting surface-mount assembly.
  • Wide operating temperature: -40°C to 85°C rating supports deployments across common industrial and commercial temperature environments.

Why Choose IC FLASH 512MBIT PAR 63VFBGA?

The NAND512W3A2SZAXE provides a balanced combination of capacity, electrical performance, and packaging for designs that require parallel NAND flash memory. Its 512 Mbit organization, 50 ns access characteristics, and 2.7 V–3.6 V supply compatibility make it suitable for systems where defined timing and standard voltage operation are important.

This device is a practical choice for engineers seeking a surface-mount NAND flash solution in a 63-VFBGA form factor, with an extended -40°C to 85°C operating range for varied environmental conditions. Its clear, published electrical and mechanical parameters support reliable integration and long-term deployment in applicable designs.

Request a quote or submit an inquiry to receive pricing and availability information for the NAND512W3A2SZAXE and to discuss volume or lead-time requirements.

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