NAND512W3A2SN6F TR

IC FLASH 512MBIT PARALLEL 48TSOP
Part Description

IC FLASH 512MBIT PARALLEL 48TSOP

Quantity 520 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package48-TSOPMemory FormatFLASHTechnologyFLASH - NAND
Memory Size512 MbitAccess Time50 nsGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page50 nsPackaging48-TFSOP (0.724", 18.40mm Width)
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of NAND512W3A2SN6F TR – IC FLASH 512MBIT PARALLEL 48TSOP

The NAND512W3A2SN6F TR is a 512 Mbit parallel NAND flash memory device from Micron Technology Inc. It implements NAND flash architecture organized as 64M × 8, providing non-volatile storage in a parallel interface format.

Designed for systems that require parallel-access non-volatile memory, the device offers a 50 ns access time, a 2.7 V to 3.6 V supply range, and an extended operating temperature range of −40°C to 85°C. It is supplied in a 48-TFSOP / 48-TSOP package suitable for board-level integration.

Key Features

  • Memory Type Non-volatile NAND flash memory organized as 64M × 8 for 512 Mbit total capacity.
  • Interface Parallel memory interface enabling byte-wide access to stored data.
  • Performance 50 ns access time and 50 ns write cycle time (word/page) for predictable read/write latency.
  • Power Operates from a 2.7 V to 3.6 V supply range to match common system voltage domains.
  • Package Available in a 48-TFSOP (0.724", 18.40 mm width) / 48-TSOP supplier device package for compact board-level mounting.
  • Temperature Range Rated for operation from −40°C to 85°C (TA) to support extended-temperature applications.

Typical Applications

  • Embedded Storage — Provides non-volatile code and data storage for embedded systems that require parallel flash memory.
  • Consumer Electronics — Used where parallel NAND flash is needed for firmware, content storage, or system-level non-volatile memory.
  • Industrial Systems — Suitable for industrial devices that require extended operating temperature support and robust non-volatile storage.

Unique Advantages

  • Parallel Interface Compatibility: Parallel NAND interface simplifies integration with controllers and designs that require byte-wide flash access.
  • Predictable Performance: 50 ns access and write cycle times provide consistent timing characteristics for system design.
  • Wide Supply Voltage Range: 2.7 V to 3.6 V compatibility supports common 3 V system domains and aids power-supply flexibility.
  • Extended Temperature Support: −40°C to 85°C operating range enables deployment in environments with temperature extremes.
  • Compact TSOP Packaging: 48-TFSOP / 48-TSOP package (0.724", 18.40 mm width) supports space-constrained PCB layouts.

Why Choose NAND512W3A2SN6F TR?

The NAND512W3A2SN6F TR offers a straightforward parallel NAND flash solution with a 512 Mbit capacity, predictable 50 ns timing, and flexible 2.7 V–3.6 V operation. Its TSOP48 package and extended temperature rating make it a practical choice for embedded and industrial designs that require reliable non-volatile storage.

Manufactured by Micron Technology Inc., this device suits engineers and procurement teams specifying parallel NAND memory for systems where capacity, timing consistency, and board-level packaging are primary selection criteria.

Request a quote or contact sales to discuss pricing, availability, and lead times for the NAND512W3A2SN6F TR.

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