NAND512W3A2SN6E

IC FLASH 512MBIT PARALLEL 48TSOP
Part Description

IC FLASH 512MBIT PARALLEL 48TSOP

Quantity 1,058 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package48-TSOPMemory FormatFLASHTechnologyFLASH - NAND
Memory Size512 MbitAccess Time50 nsGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page50 nsPackaging48-TFSOP (0.724", 18.40mm Width)
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of NAND512W3A2SN6E – 512 Mbit Parallel NAND Flash (48‑TSOP)

The NAND512W3A2SN6E is a 512 Mbit non-volatile NAND flash memory in a parallel interface format. It implements NAND flash architecture with a 64M x 8 organization and is supplied in a 48-TFSOP / 48-TSOP package.

Designed for electronic systems requiring parallel flash storage, the device offers standard NAND performance characteristics and a supply voltage range suitable for many embedded applications.

Key Features

  • Technology  NAND flash non-volatile memory providing persistent data storage in a 64M x 8 organization.
  • Memory Size & Organization  512 Mbit capacity organized as 64M x 8 for byte-oriented parallel access patterns.
  • Interface  Parallel memory interface for integration with parallel-memory controllers and legacy parallel bus designs.
  • Performance  Access time: 50 ns; write cycle time (word/page): 50 ns—specs suitable for typical parallel NAND read/write operations.
  • Power  Supply voltage range: 2.7 V to 3.6 V to support common 3 V system rails.
  • Package  48-TFSOP (0.724", 18.40 mm width) / 48-TSOP footprint for surface-mount PCB implementations.
  • Operating Temperature  Rated for −40°C to 85°C (TA) to support a wide range of ambient conditions.

Typical Applications

  • Embedded Systems  Parallel NAND storage for firmware, code shadowing, and data retention in microcontroller- or processor-based designs.
  • Consumer Electronics  Non-volatile storage for devices that require compact flash memory in a surface-mount TSOP package.
  • Industrial Control  Persistent storage in control and instrumentation equipment operating across a −40°C to 85°C ambient range.

Unique Advantages

  • 512 Mbit capacity in a compact TSOP  Provides substantial non-volatile storage while maintaining a small 48-pin surface-mount footprint.
  • Parallel interface simplicity  Byte-organized 64M x 8 layout and parallel access simplify integration with parallel memory controllers.
  • Deterministic access and write timings  50 ns access and 50 ns write-cycle specifications support predictable memory performance in system design.
  • Wide supply voltage window  Operates from 2.7 V to 3.6 V to match common 3 V system rails and tolerate supply variations.
  • Extended operating temperature  Rated from −40°C to 85°C for deployment in a broad range of environmental conditions.

Why Choose IC FLASH 512MBIT PARALLEL 48TSOP?

The NAND512W3A2SN6E combines a 512 Mbit NAND architecture with a parallel interface and compact 48-TSOP package to address designs that need solid non-volatile storage in a surface-mount form factor. Its defined access and write timings, together with a 2.7 V–3.6 V supply range and −40°C to 85°C operating window, make it suitable for a variety of embedded and industrial applications.

Manufactured by Micron Technology Inc., this device is positioned for designers seeking a straightforward parallel NAND flash option with clear, verifiable specifications for integration into system-level memory solutions.

Request a quote or submit an availability inquiry to receive pricing and lead-time information for the NAND512W3A2SN6E.

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