MCIMX27MJP4AR2

IC MPU I.MX27 400MHZ 473LFBGA
Part Description

ARM926EJ-S Microprocessor IC i.MX27 1 Core, 32-Bit 400MHz 473-LFBGA (19x19)

Quantity 1,739 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 27
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPSecurity; SAHARAH2Core ProcessorARM926EJ-SDevice Package473-LFBGA (19x19)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case473-LFBGARAM ControllersDDR
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesCryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Speed400MHzSupplier Device Package473-LFBGA (19×19)USBUSB 2.0 + PHY (3)
Voltage – I/O2.0V, 2.5V, 2.7V, 3.0V

Overview of MCIMX27MJP4AR2 – IC MPU I.MX27 400MHZ 473LFBGA

The MCIMX27MJP4AR2 is an ARM926EJ-S based multimedia applications microprocessor from the i.MX27 series, operating at up to 400 MHz in a single 32-bit core configuration. Designed for low-power, feature-rich embedded products, the device targets portable multimedia and handheld applications with integrated interfaces and on-chip security capabilities.

Built on 90 nm technology with low-power techniques such as DPTC, power gating and clock gating, the i.MX27 family balances performance and leakage for battery-operated and thermally constrained systems while offering industrial temperature qualification.

Key Features

  • Core and Performance  ARM926EJ-S single 32-bit core running at up to 400 MHz, providing deterministic processing for embedded multimedia workloads.
  • Memory and Controllers  Integrated DDR memory controller to support system memory requirements.
  • Security Subsystem  Includes SAHARAH2 co-processor and security features such as cryptography engines, a random number generator, RTIC, secure fusebox and secure memory for protected boot and data protection.
  • Low-Power Design  Implemented with DPTC, power gating and clock gating techniques and 90 nm dual-Vt process optimizations to reduce power consumption and leakage.
  • Display and Human Interface  Display interface controllers for LCD and keypad integration to support user interfaces on portable devices.
  • Connectivity  On-chip 10/100 Mbps Ethernet and multiple USB 2.0 ports with PHY provide wired networking and host/device connectivity; additional 1-Wire interface for simple sensor or identification links.
  • Graphics Acceleration  Graphics acceleration capability to offload display rendering tasks from the CPU.
  • Package and Mounting  Supplied in a 473-LFBGA (19 × 19 mm) surface-mount package to support compact PCB designs.
  • Industrial Temperature Range  Qualified for operation from −40 °C to 85 °C for rugged and industrial deployments.
  • RoHS Compliance  Device is RoHS compliant to meet environmental requirements.

Typical Applications

  • Feature-rich Cellular Phones  Provides multimedia processing, display and connectivity building blocks for advanced handset features.
  • Portable Media Players & Mobile Gaming  Integrates display interfaces, graphics acceleration and low-power operation for handheld entertainment devices.
  • Personal Digital Assistants (PDAs)  Offers a compact, low-power processor platform for PDA and wireless PDA form factors with user-interface support.
  • Portable Consumer Electronics  Suited for devices such as portable DVD players and digital cameras that require multimedia handling and compact packaging.

Unique Advantages

  • Integrated Multimedia Platform: Combines an ARM926EJ-S core with DDR controller, display interfaces and graphics acceleration to reduce external component count.
  • Comprehensive Security: On-chip SAHARAH2 co-processor plus cryptography, RNG, RTIC and secure fusebox/secure memory support secure boot and protected data storage.
  • Power-Optimized Silicon: 90 nm process with DPTC, power gating and clock gating helps lower operating power and leakage in portable designs.
  • Industrial Qualification and Temperature Range: Rated for −40 °C to 85 °C operation, suitable for extended-environment deployments.
  • Rich I/O and Connectivity: Integrated Ethernet, multiple USB 2.0 + PHY ports and 1-Wire interface provide flexible system-level connectivity options.
  • Compact Package: 473-LFBGA (19 × 19 mm) package supports high integration in space-constrained PCBs.

Why Choose MCIMX27MJP4AR2?

The MCIMX27MJP4AR2 delivers a balanced combination of processing capability, integrated multimedia and security features, and power-saving silicon techniques suitable for portable and embedded multimedia products. As a member of the i.MX27 series from NXP Semiconductors, it provides a consistent architecture for designs that require low-power operation, industrial temperature qualification and built-in connectivity.

This device is appropriate for designers building compact consumer and industrial handhelds that need on-chip display support, secure operation and reliable networking without excessive external components, helping simplify BOM and layout while meeting RoHS and temperature requirements.

Request a quote or submit an inquiry to discuss pricing and availability for the MCIMX27MJP4AR2. Our team can provide lead-time and ordering information to support your design schedule.

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