SPC5643LFF2MMM1

IC MCU 32BIT 1MB FLASH 257MAPBGA
Part Description

e200z4 MPC56xx Qorivva Microcontroller IC 32-Bit Dual-Core 120MHz 1MB (1M x 8) FLASH 257-LFBGA (14x14)

Quantity 440 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSPC5643
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

ConnectivityCANbus, FlexRay, LINbus, SPI, UART/USARTCore Processore200z4Core Size32-Bit Dual-Core
Data ConvertersA/D 32x12bDevice Package257-LFBGA (14x14)ECCN3A991A2
GradeAutomotiveHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountOperating Temperature-40°C ~ 125°C (TA)
Oscillator TypeInternalPackage / Case257-LFBGAPeripheralsDMA, POR, PWM, WDT
Program Memory Size1MB (1M x 8)Program Memory TypeFLASHRAM Size128K x 8
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed120MHz
Supplier Device Package257-LFBGA (14×14)Voltage – Supply (Vcc/Vdd)3V ~ 5.5V

Overview of SPC5643LFF2MMM1 – 32‑Bit Dual‑Core MCU, 1 MB Flash

The SPC5643LFF2MMM1 from NXP Semiconductors is a 32‑bit dual‑core microcontroller based on e200z4 cores with 1 MB of on‑chip FLASH. With 120 MHz core speed, 3.3 V I/O and an integrated ADC interface, it is intended for embedded and industrial applications that require balanced processing capability, integrated analog I/O and extended temperature operation.

Packaged in a compact 257‑LFBGA (14×14) surface‑mount package and qualified for industrial use, the device targets applications that need on‑board code storage, multiple processing contexts and reliable operation across a wide temperature range.

Key Features

  • Core – Dual e200z4 32‑bit cores at 120 MHz providing parallel processing capability for multi‑task and control-oriented workloads.
  • Memory – 1 MB (1M × 8) on‑chip FLASH for application code and data storage.
  • Power and I/O – 3.3 V I/O signaling for common embedded interface compatibility.
  • Analog and Interfaces – Integrated ADC interface to support sensor acquisition and analog signal measurement.
  • Package and Mounting – 257‑LFBGA (14×14) supplier device package, surface mount for compact PCB integration.
  • Operating Range and Qualification – Industrial qualification with an operating temperature range of −40 °C to 125 °C for extended environmental tolerance.
  • Regulatory Status – RoHS compliant.
  • Graphics Acceleration – No graphics acceleration included.

Typical Applications

  • Industrial Control – Use the dual cores and ADC interface for control algorithms, sensor acquisition and deterministic task separation in factory automation and process control.
  • Motor and Drive Systems – On‑chip FLASH and dual processing capability support control firmware and real‑time loop handling for motor control applications.
  • Instrumentation – Extended temperature range and ADC integration make this device suitable for instrumentation and measurement systems operating in harsh environments.
  • Embedded Systems – Compact LFBGA package and 3.3 V I/O enable integration into space‑constrained embedded platforms requiring local application storage and processing.

Unique Advantages

  • Dual‑core processing: Enables separation of high‑priority control tasks and background processing to improve system determinism.
  • 1 MB on‑chip FLASH: Provides ample code and data space for complex embedded applications without immediate external memory requirements.
  • Wide operating temperature: −40 °C to 125 °C supports deployments in demanding thermal environments.
  • Integrated ADC interface: Simplifies sensor interfacing and reduces bill‑of‑materials by handling analog inputs on‑chip.
  • Compact LFBGA package: 257‑ball 14×14 LFBGA delivers high integration density for space‑sensitive PCB layouts.
  • Industrial qualification and RoHS compliance: Aligns with environmental and industrial usage requirements.

Why Choose SPC5643LFF2MMM1?

The SPC5643LFF2MMM1 combines dual e200z4 32‑bit cores at 120 MHz with 1 MB of on‑chip FLASH, integrated ADC capability and a compact 257‑LFBGA package to deliver a well‑rounded solution for embedded and industrial designs. Its 3.3 V I/O and industrial temperature rating support reliable integration into a wide range of systems that require local code storage and analog interfacing.

Backed by NXP Semiconductors and qualified for industrial use, this device is suited for engineers looking for a scalable processing platform with on‑board memory and analog capability, supporting long‑term deployments in challenging environmental conditions.

Request a quote or submit a pricing and availability inquiry for SPC5643LFF2MMM1 to get started with your design procurement.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up